Inventor

TSAI HUI-JUNG

TW78 patents

⚠️ This page may combine multiple inventors who share the name “TSAI HUI-JUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TSAI HUI-JUNG

TAIWAN SEMICONDUCTOR MFG CO LTD

Semiconductor structures and methods of forming the same

Processes for reducing leakage and improving adhesion

Processes for reducing leakage and improving adhesion

Package structure having taper-shaped conductive pillar and method of forming thereof

Semiconductor structure and method of fabricating the same

Processes for reducing leakage and improving adhesion

Semiconductor package and manufacturing process thereof

Semiconductor device and method

Semiconductor package and method

Dense redistribution layers in semiconductor packages and methods of forming the same

Semiconductor package and manufacturing process thereof

Method of forming Cu pillar bump with non-metal sidewall spacer and metal top cap

Semiconductor packages having a seed layer structure protruding from an edge of metal structure

Package structure and method of fabricating the same

Package structure having at least one die with a plurality of taper-shaped die connectors

Method for removing resist layer, and method of manufacturing semiconductor

Semiconductor structure and method of fabricating the same

Package structure and method of fabricating the same

Integrated circuit, package structure, and manufacturing method of package structure

Semiconductor device and method

Dense redistribution layers in semiconductor packages and methods of forming the same

Semiconductor package and method

Method for removing resist layer, and method of manufacturing semiconductor

Semiconductor device having via sidewall adhesion with encapsulant

Method of manufacturing semiconductor package

Integrated fan-out package and method of fabricating the same

Semiconductor package and method

Semiconductor structures

Semiconductor structure and method of forming the same

Method of fabricating package structure

Semiconductor device and method

Semiconductor structure and method of forming the same

Semiconductor device and method

Semiconductor packages and methods of manufacturing the same

Dense redistribution layers in semiconductor packages and methods of forming the same

Semiconductor package and manufacturing process thereof

Package structure including a die having a taper-shaped die connector

Packages with enlarged through-vias in encapsulant

Method of fabricating semiconductor structure

Package structure

Method of forming RDLs and structure formed thereof

Method for removing resistor layer, and method of manufacturing semiconductor

Package structure and method of fabrcating the same

Integrated circuit, package structure, and manufacturing method of package structure

Method of detecting photoresist scum, method of forming semiconductor package and photoresist scum detection apparatus

Semiconductor device having via sidewall adhesion with encapsulant

Method of fabricating semiconductor structure

Processes for reducing leakage and improving adhesion

HWANG CHIEN LING

Cu pillar bump with non-metal sidewall spacer and metal top cap

TSAI HUI-JUNG

Cleaning methods and compositions