Inventor

KUO HUNG-JUI

TW365 patents

⚠️ This page may combine multiple inventors who share the name “KUO HUNG-JUI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KUO HUNG-JUI

TAIWAN SEMICONDUCTOR MFG CO LTD

Method of forming semiconductor packages having through package vias

Photoactive compound gradient photoresist

Semiconductor structure and method of forming

Semiconductor structures and methods of forming the same

Advanced structure for info wafer warpage reduction

Processes for reducing leakage and improving adhesion

Semiconductor packages and manufacturing methods thereof

Sensing component encapsulated by an encapsulation layer with a roughness surface having a hollow region

Fan-out interconnect structure and methods forming the same

Semiconductor package and manufacturing method thereof

Processes for reducing leakage and improving adhesion

Package structure having taper-shaped conductive pillar and method of forming thereof

Semiconductor device and method of manufacture

Chip package and method of forming the same

Sensing die encapsulated by an encapsulant with a roughness surface having a hollow region

Sensing component encapsulated by an encapsulant with a roughness surface having a hollow region

Semiconductor package and method of forming the same

Integrated fan-out package and manufacturing method thereof

Processes for reducing leakage and improving adhesion

Semiconductor package and method

Semiconductor package and method of forming the same

Semiconductor package and manufacturing process thereof

Semiconductor device and method

Semiconductor device and method

Semiconductor package and method

Packae structure, RDL structure and method of forming the same

Planarizing RDLs in RDL-first processes through CMP process

Integrated fan-out package and method of fabricating the same

Package structure and method of manufacturing the same

Semiconductor structure and method of forming

Dense redistribution layers in semiconductor packages and methods of forming the same

Integrated fan-out package and method of fabricating the same

Info structure and method forming same

Semicondcutor device package and method of forming semicondcutor device package

Semiconductor package and manufacturing process thereof

Package structures and methods for forming the same

Semiconductor structure and method of forming

Via structure for packaging and a method of forming

Package and manufacturing method thereof

Integrated fan-out package

Semiconductor device and method

Semiconductor device and method of manufacturing the same

Semiconductor packages having a seed layer structure protruding from an edge of metal structure

Die and package structure

Composition for sacrificial film, package, manufacturing method of package

TAIWAN SEMICONDUCTOR MFG

Integrated structure in wafer level package

Approach to increase the resolution of dense line/space patterns for 0.18 micron and below design rules using attenuating phase shifting masks

CHEN HSIEN-WEI

Structure to increase resistance to electromigration

LIN CHUN-HUNG

Stress compensation layer for 3D packaging

LAI CHIH-WEI

Adjusting sizes of connectors of package components