Inventor
LANGARI ABDOLREZA
US9 patents
⚠️ This page may combine multiple inventors who share the name “LANGARI ABDOLREZA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
QUALCOMM INC
4 patentsUS11670614B2Jun 6, 2023
Integrated circuit assembly with hybrid bonding
QUALCOMM INC3 citations72
US12300655B2May 13, 2025
Integrated circuit assembly with hybrid bonding
QUALCOMM INC0 citations62
US11437307B2Sep 6, 2022
Device comprising first solder interconnects aligned in a first direction and second solder interconnects aligned in a second direction
QUALCOMM INC0 citations59
US10916494B2Feb 9, 2021
Device comprising first solder interconnects aligned in a first direction and second solder interconnects aligned in a second direction
QUALCOMM INC0 citations59