Inventor
HUANG CHING-LIOU
US13 patents
⚠️ This page may combine multiple inventors who share the name “HUANG CHING-LIOU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MEDIATEK INC
7 patentsUS9142526B2Sep 22, 2015
Semiconductor package with solder resist capped trace to prevent underfill delamination
MEDIATEK INC5 citations83
US9659893B2May 23, 2017
Semiconductor package
MEDIATEK INC2 citations72
US9640505B2May 2, 2017
Semiconductor package with trace covered by solder resist
MEDIATEK INC3 citations72
US9209148B2Dec 8, 2015
Semiconductor package
MEDIATEK INC2 citations61
US10312210B2Jun 4, 2019
Semiconductor package
MEDIATEK INC0 citations51
US9972593B2May 15, 2018
Semiconductor package
MEDIATEK INC1 citations51
US9548271B2Jan 17, 2017
Semiconductor package
MEDIATEK INC0 citations51
QUALCOMM INC
3 patentsUS11437307B2Sep 6, 2022
Device comprising first solder interconnects aligned in a first direction and second solder interconnects aligned in a second direction
QUALCOMM INC0 citations59
US10916494B2Feb 9, 2021
Device comprising first solder interconnects aligned in a first direction and second solder interconnects aligned in a second direction
QUALCOMM INC0 citations59
US12362269B2Jul 15, 2025
Integrated circuit (IC) packages employing supplemental metal layer coupled to embedded metal traces in a die-side embedded trace substrate (ETS) layer, and related fabrication methods
QUALCOMM INC0 citations49