Inventor
KALITA LAKSHESWAR
US17 patents
Patents
17 patentsUS9903020B2Feb 27, 2018
Generation of compact alumina passivation layers on aluminum plasma equipment components
APPLIED MATERIALS INC108 citations96
US11515195B2Nov 29, 2022
Semiconductor chamber components with high-performance coating
APPLIED MATERIALS INC6 citations84
US10755900B2Aug 25, 2020
Multi-layer plasma erosion protection for chamber components
APPLIED MATERIALS INC7 citations83
US11562890B2Jan 24, 2023
Corrosion resistant ground shield of processing chamber
APPLIED MATERIALS INC4 citations75
US11834744B2Dec 5, 2023
Ceramic showerheads with conductive electrodes
APPLIED MATERIALS INC2 citations71
US10920319B2Feb 16, 2021
Ceramic showerheads with conductive electrodes
APPLIED MATERIALS INC1 citations71
US12548742B2Feb 10, 2026
Corrosion resistant ground shield of processing chamber
APPLIED MATERIALS INC0 citations62
US12522923B2Jan 13, 2026
Advanced barrier nickel oxide (BNiO) coating development for process chamber components via ozone treatment
APPLIED MATERIALS INC0 citations62
US12512361B2Dec 30, 2025
Semiconductor chamber components with high-performance coating
APPLIED MATERIALS INC0 citations61
US11591693B2Feb 28, 2023
Ceramic showerheads with conductive electrodes
APPLIED MATERIALS INC0 citations61
US10233554B2Mar 19, 2019
Aluminum electroplating and oxide formation as barrier layer for aluminum semiconductor process equipment
APPLIED MATERIALS INC1 citations59
US12406832B2Sep 2, 2025
Semiconductor chamber components with advanced dual layer nickel-containing coatings
APPLIED MATERIALS INC0 citations57
US12362150B2Jul 15, 2025
Semiconductor chamber components with advanced coating techniques
APPLIED MATERIALS INC0 citations57
US11557464B2Jan 17, 2023
Semiconductor chamber coatings and processes
APPLIED MATERIALS INC0 citations52
US10253406B2Apr 9, 2019
Method for forming yttrium oxide on semiconductor processing equipment
APPLIED MATERIALS INC0 citations49
US11715625B2Aug 1, 2023
Semiconductor processing chamber
APPLIED MATERIALS INC0 citations46
US10407789B2Sep 10, 2019
Uniform crack-free aluminum deposition by two step aluminum electroplating process
APPLIED MATERIALS INC0 citations37