P

Inventor

LUBOMIRSKY DMITRY

US226 patents
⚠️ This page may combine multiple inventors who share the name “LUBOMIRSKY DMITRY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

APPLIED MATERIALS INC

46 patents
US9991134B2Jun 5, 2018

Processing systems and methods for halide scavenging

APPLIED MATERIALS INC100 citations99
US9934942B1Apr 3, 2018

Chamber with flow-through source

APPLIED MATERIALS INC108 citations99
US9837249B2Dec 5, 2017

Radial waveguide systems and methods for post-match control of microwaves

APPLIED MATERIALS INC111 citations99
US9704723B2Jul 11, 2017

Processing systems and methods for halide scavenging

APPLIED MATERIALS INC114 citations99
US9659792B2May 23, 2017

Processing systems and methods for halide scavenging

APPLIED MATERIALS INC125 citations99
US9607856B2Mar 28, 2017

Selective titanium nitride removal

APPLIED MATERIALS INC126 citations99
US9564296B2Feb 7, 2017

Radial waveguide systems and methods for post-match control of microwaves

APPLIED MATERIALS INC129 citations99
US9449850B2Sep 20, 2016

Processing systems and methods for halide scavenging

APPLIED MATERIALS INC135 citations99
US9362130B2Jun 7, 2016

Enhanced etching processes using remote plasma sources

APPLIED MATERIALS INC138 citations99
US9355922B2May 31, 2016

Systems and methods for internal surface conditioning in plasma processing equipment

APPLIED MATERIALS INC150 citations99
US9299538B2Mar 29, 2016

Radial waveguide systems and methods for post-match control of microwaves

APPLIED MATERIALS INC154 citations99
US9299537B2Mar 29, 2016

Radial waveguide systems and methods for post-match control of microwaves

APPLIED MATERIALS INC160 citations99
US9184055B2Nov 10, 2015

Processing systems and methods for halide scavenging

APPLIED MATERIALS INC181 citations99
US9153442B2Oct 6, 2015

Processing systems and methods for halide scavenging

APPLIED MATERIALS INC220 citations99
US9144147B2Sep 22, 2015

Semiconductor processing system and methods using capacitively coupled plasma

APPLIED MATERIALS INC188 citations99
US9093371B2Jul 28, 2015

Processing systems and methods for halide scavenging

APPLIED MATERIALS INC184 citations99
US9040422B2May 26, 2015

Selective titanium nitride removal

APPLIED MATERIALS INC194 citations99
US9023732B2May 5, 2015

Processing systems and methods for halide scavenging

APPLIED MATERIALS INC187 citations99
US8357435B2Jan 22, 2013

Flowable dielectric equipment and processes

APPLIED MATERIALS INC160 citations99
US7541297B2Jun 2, 2009

Method and system for improving dielectric film quality for void free gap fill

APPLIED MATERIALS INC664 citations99
US7465358B2Dec 16, 2008

Measurement techniques for controlling aspects of a electroless deposition process

APPLIED MATERIALS INC235 citations99
US10923367B2Feb 16, 2021

Process chamber for etching low K and other dielectric films

APPLIED MATERIALS INC41 citations98
US10062585B2Aug 28, 2018

Oxygen compatible plasma source

APPLIED MATERIALS INC102 citations98
US9978564B2May 22, 2018

Chemical control features in wafer process equipment

APPLIED MATERIALS INC106 citations98
US9966240B2May 8, 2018

Systems and methods for internal surface conditioning assessment in plasma processing equipment

APPLIED MATERIALS INC101 citations98
US9885117B2Feb 6, 2018

Conditioned semiconductor system parts

APPLIED MATERIALS INC108 citations98
US9741593B2Aug 22, 2017

Thermal management systems and methods for wafer processing systems

APPLIED MATERIALS INC115 citations98
US9728437B2Aug 8, 2017

High temperature chuck for plasma processing systems

APPLIED MATERIALS INC123 citations98
US9593421B2Mar 14, 2017

Particle generation suppressor by DC bias modulation

APPLIED MATERIALS INC63 citations98
US9499898B2Nov 22, 2016

Layered thin film heater and method of fabrication

APPLIED MATERIALS INC130 citations98
US9212099B2Dec 15, 2015

Heat treated ceramic substrate having ceramic coating and heat treatment for coated ceramics

APPLIED MATERIALS INC56 citations98
US9132436B2Sep 15, 2015

Chemical control features in wafer process equipment

APPLIED MATERIALS INC198 citations98
US9117855B2Aug 25, 2015

Polarity control for remote plasma

APPLIED MATERIALS INC184 citations98
US9090046B2Jul 28, 2015

Ceramic coated article and process for applying ceramic coating

APPLIED MATERIALS INC68 citations98
US7989365B2Aug 2, 2011

Remote plasma source seasoning

APPLIED MATERIALS INC621 citations98
US7341633B2Mar 11, 2008

Apparatus for electroless deposition

APPLIED MATERIALS INC230 citations98
US10354843B2Jul 16, 2019

Chemical control features in wafer process equipment

APPLIED MATERIALS INC40 citations97
US9773648B2Sep 26, 2017

Dual discharge modes operation for remote plasma

APPLIED MATERIALS INC114 citations97
US9093389B2Jul 28, 2015

Method of patterning a silicon nitride dielectric film

APPLIED MATERIALS INC104 citations97
US8802572B2Aug 12, 2014

Method of patterning a low-k dielectric film

APPLIED MATERIALS INC115 citations97
US6673199B1Jan 6, 2004

Shaping a plasma with a magnetic field to control etch rate uniformity

APPLIED MATERIALS INC107 citations97
US6185839B1Feb 13, 2001

Semiconductor process chamber having improved gas distributor

APPLIED MATERIALS INC83 citations97
US9903020B2Feb 27, 2018

Generation of compact alumina passivation layers on aluminum plasma equipment components

APPLIED MATERIALS INC108 citations96
US9691645B2Jun 27, 2017

Bolted wafer chuck thermal management systems and methods for wafer processing systems

APPLIED MATERIALS INC118 citations96
US6444040B1Sep 3, 2002

Gas distribution plate

APPLIED MATERIALS INC56 citations96
US6326597B1Dec 4, 2001

Temperature control system for process chamber

APPLIED MATERIALS INC659 citations96

LUBOMIRSKY DMITRY

2 patents

NEMANI SRINIVAS D

1 patent

CHUC KIEN N

1 patent

Showing the top 50 of 226 patents by PatentIndex Score.