Inventor
HONG SUNG-BOK
KR9 patents
Patents
9 patentsUS5979739ANov 9, 1999
Semiconductor die bonding apparatus having multiple bonding system
SAMSUNG ELECTRONICS CO LTD59 citations94
US5765277AJun 16, 1998
Die bonding apparatus with a revolving pick-up tool
SAMSUNG ELECTRONICS CO LTD65 citations94
US6863109B2Mar 8, 2005
In-line die attaching and curing apparatus for a multi-chip package
SAMSUNG ELECTRONICS CO LTD25 citations90
US8672210B2Mar 18, 2014
Capillary exchange system of semiconductor wire bonding
SAMSUNG ELECTRONICS CO LTD12 citations80
US7074646B2Jul 11, 2006
In-line die attaching and curing apparatus for a multi-chip package
SAMSUNG ELECTRONICS CO LTD10 citations71
US6187121B1Feb 13, 2001
Die-bonding equipment and a method for detecting residual adhesive material using the same
SAMSUNG ELECTRONICS CO LTD5 citations57
US11011395B2May 18, 2021
Cover structure for a light source, light illuminating apparatus having the same
SAMSUNG ELECTRONICS CO LTD0 citations54
US11081374B2Aug 3, 2021
Semiconductor package molding device and method of manufacturing semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations47
US8905290B2Dec 9, 2014
Apparatus for mounting semiconductor chips on a circuit board
SAMSUNG ELECTRONICS CO LTD0 citations32