Inventor

REFAI-AHMED GAMAL

US71 patents

⚠️ This page may combine multiple inventors who share the name “REFAI-AHMED GAMAL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

REFAI-AHMED GAMAL

XILINX INC

Heterogeneous integration module comprising thermal management apparatus

Methods and apparatus for thermal interface material (TIM) bond line thickness (BLT) reduction and TIM adhesion enhancement for efficient thermal management

Stacked silicon package having a thermal capacitance element

Stacked silicon package assembly having an enhanced lid

Thermal management device with textured surface for extended cooling limit

Force balanced package mounting

Dynamic mounting thermal management for devices on board

Electronic device apparatus with multiple thermally conductive paths for heat dissipation

Integrated circuit package, and methods and tools for fabricating the same

Micro device with through PCB cooling

Thermal heat spreader plate for electronic device

Stacked silicon package assembly having vertical thermal management

Remote active cooling heat exchanger and antenna system with the same

Stacked silicon package assembly having thermal management using phase change material

Stacked silicon package assembly having thermal management

Integrated circuit die with in-chip heat sink

Three-dimensional thermal management apparatuses for electronic devices

Thermal enablement of dies with impurity gettering

Radome with integrated passive cooling

Chip package with pass through heat spreader

ATI TECHNOLOGIES ULC

Cross-flow thermal management device and method of manufacture thereof

Multi-die semiconductor package with heat spreader

Thermal management apparatus and method for a circuit substrate

Three-dimensional thermal spreading in an air-cooled thermal device

Heat sink for a circuit device

Variable spring rate thermal management apparatus attachment mechanism

REFAI-AHMED GAMAL

Stacked semiconductor chip device with thermal management

Portable computing device with thermal management

Semiconductor chip device with liquid thermal interface material

Holistic thermal management system for a semiconductor chip

Stacked semiconductor chips with thermal management

Stacked semiconductor chip device with thermal management circuit board

GEN ELECTRIC

Heat spreader with flexible tolerance mechanism

Thermal clamp apparatus for electronic systems

Integrated compact impingement on extended heat surface

Hydrogen detector and hydrogen detection method

Vibrational fluid mover active controller

Vibrational fluid mover jet with active damping mechanism

SU MICHAEL Z

Semiconductor chip device with underfill

Semiconductor chip with reinforcing through-silicon-vias

Semiconductor chip with reinforcing through-silicon-vias

Semiconductor chip device with polymeric filler trench

Method of manufacturing and assembling semiconductor chips with offset pads

ADVANCED MICRO DEVICES INC

Thermal interface material with support structure

Semiconductor chip with redundant thru-silicon-vias

ATI TECHNOLOGIES INC

Thermal management apparatus

Thermal management device for multiple heat producing devices

PTS CORP

Field reconfigurable line cards for an optical transport system

BLACK BRYAN

Semiconductor chip with redundant thru-silicon-vias

TOUZELBAEV MAXAT N

Semiconductor chip thermal interface structures