Inventor
MIYAMOTO NOBUAKI
JP18 patents
⚠️ This page may combine multiple inventors who share the name “MIYAMOTO NOBUAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
JX NIPPON MINING & METALS CORP
9 patentsUS9955583B2Apr 24, 2018
Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board
JX NIPPON MINING & METALS CORP10 citations77
US11375624B2Jun 28, 2022
Surface treated copper foil, copper clad laminate, and printed circuit board
JX NIPPON MINING & METALS CORP1 citations73
US10349531B2Jul 9, 2019
Carrier-attached copper foil, laminate, laminate producing method, printed wiring board producing method, and electronic device producing method
JX NIPPON MINING & METALS CORP3 citations71
US11382217B2Jul 5, 2022
Surface treated copper foil, copper clad laminate, and printed circuit board
JX NIPPON MINING & METALS CORP0 citations62
US11337314B2May 17, 2022
Surface treated copper foil, copper clad laminate, and printed circuit board
JX NIPPON MINING & METALS CORP0 citations62
US11337315B2May 17, 2022
Surface treated copper foil, copper clad laminate, and printed circuit board
JX NIPPON MINING & METALS CORP0 citations62
US10356898B2Jul 16, 2019
Carrier-attached copper foil, laminate, method for producing printed wiring board, and method for producing electronic device
JX NIPPON MINING & METALS CORP1 citations62
US10299385B2May 21, 2019
Carrier-attached copper foil, laminate, method for producing printed wiring board, and method for producing electronic device
JX NIPPON MINING & METALS CORP1 citations62
US10251283B2Apr 2, 2019
Carrier-attached copper foil, laminate, method for producing printed wiring board, and method for producing electronic device
JX NIPPON MINING & METALS CORP1 citations62
HITACHI CABLE
5 patentsUS7939935B2May 10, 2011
Electronic device substrate, electronic device and methods for fabricating the same
HITACHI CABLE25 citations92
US7880091B2Feb 1, 2011
Electronic device substrate, electronic device and methods for making same
HITACHI CABLE13 citations84
US7705245B2Apr 27, 2010
Electronic device substrate and its fabrication method, and electronic device and its fabrication method
HITACHI CABLE8 citations84
US7681310B2Mar 23, 2010
Method for fabricating double-sided wiring board
HITACHI CABLE12 citations83
US7780836B2Aug 24, 2010
Method for fabricating a multilayer wiring board, multilayer wiring board, and electronic device using the same
HITACHI CABLE5 citations62