Inventor
ARIKAWA TADASHI
JP9 patents
⚠️ This page may combine multiple inventors who share the name “ARIKAWA TADASHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOKYO TUNGSTEN KK
5 patentsUS5493153AFeb 20, 1996
Plastic-packaged semiconductor device having a heat sink matched with a plastic package
TOKYO TUNGSTEN KK59 citations95
US6475429B2Nov 5, 2002
Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the same
TOKYO TUNGSTEN KK19 citations91
US6271585B1Aug 7, 2001
Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the same
TOKYO TUNGSTEN KK32 citations91
US6693353B1Feb 17, 2004
Semiconductor package and method for producing heat-radiating substrate for it
TOKYO TUNGSTEN KK13 citations82
US6926861B2Aug 9, 2005
Semiconductor package and method for producing heat-radiating substrate for it
TOKYO TUNGSTEN KK6 citations71
ALMT CORP
3 patentsUS7083759B2Aug 1, 2006
Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directions
ALMT CORP10 citations71
US10215512B2Feb 26, 2019
Heat spreader and method for manufacturing the same
ALMT CORP1 citations53
US7547412B2Jun 16, 2009
Composite material, method for producing same and member using same
ALMT CORP0 citations47