Inventor
CHUANG BING-HAN
CN2 patents
Patents
2 patentsUS11264231B2Mar 1, 2022
Method for manufacturing backside metalized compound semiconductor wafer
XIAMEN SANAN INTEGRATED CIRCUIT CO LTD0 citations50
US11823891B2Nov 21, 2023
Backside metallized compound semiconductor device and method for manufacturing the same
XIAMEN SANAN INTEGRATED CIRCUIT CO LTD0 citations41