Inventor
MORROW PATRICK R
US6 patents
Patents
6 patentsUS7410884B2Aug 12, 2008
3D integrated circuits using thick metal for backside connections and offset bumps
INTEL CORP278 citations98
US11437283B2Sep 6, 2022
Backside contacts for semiconductor devices
INTEL CORP12 citations85
US11672133B2Jun 6, 2023
Vertically stacked memory elements with air gap
INTEL CORP1 citations62
US7723759B2May 25, 2010
Stacked wafer or die packaging with enhanced thermal and device performance
INTEL CORP6 citations62
US12080605B2Sep 3, 2024
Backside contacts for semiconductor devices
INTEL CORP1 citations60
US7745940B2Jun 29, 2010
Forming ultra dense 3-D interconnect structures
INTEL CORP2 citations60