Inventor
OOBAYASHI TAKASHI
JP2 patents
Patents
2 patentsUS5641996AJun 24, 1997
Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD190 citations97
US6139777AOct 31, 2000
Conductive paste for filling via-hole, double-sided and multilayer printed circuit boards using the same, and method for producing the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD87 citations96