Inventor
PON FLORENCE R
US13 patents
Patents
13 patentsUS10032707B2Jul 24, 2018
Post-grind die backside power delivery
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US9917041B1Mar 13, 2018
3D chip assemblies using stacked leadframes
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US11552051B2Jan 10, 2023
Electronic device package
INTEL CORP1 citations61
US12068283B2Aug 20, 2024
Die stack with cascade and vertical connections
INTEL CORP0 citations59
US11749653B2Sep 5, 2023
Multi-die, vertical-wire package-in-package apparatus, and methods of making same
INTEL CORP0 citations59
US11171114B2Nov 9, 2021
Die stack with cascade and vertical connections
INTEL CORP0 citations59
US11064612B2Jul 13, 2021
Buried electrical debug access port
INTEL CORP0 citations59
US10910301B2Feb 2, 2021
Post-grind die backside power delivery
INTEL CORP0 citations59
US11562978B2Jan 24, 2023
Decoupling capacitor mounted on an integrated circuit die, and method of manufacturing the same
INTEL CORP1 citations54
US11901274B2Feb 13, 2024
Packaged integrated circuit device with recess structure
INTEL CORP0 citations51
US10483198B2Nov 19, 2019
Post-grind die backside power delivery
INTEL CORP0 citations49
US10090261B2Oct 2, 2018
Microelectronic package debug access ports and methods of fabricating the same
INTEL CORP0 citations48
US9646952B2May 9, 2017
Microelectronic package debug access ports
INTEL CORP0 citations48