Inventor
ZHONG CHONG HUA
US3 patents
Patents
3 patentsUS6879039B2Apr 12, 2005
Ball grid array package substrates and method of making the same
BROADCOM CORP54 citations94
US7196415B2Mar 27, 2007
Low voltage drop and high thermal performance ball grid array package
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US7405145B2Jul 29, 2008
Ball grid array package substrates with a modified central opening and method for making the same
BROADCOM CORP11 citations82