Inventor
STAFFORD NATHAN
US31 patents
⚠️ This page may combine multiple inventors who share the name “STAFFORD NATHAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AIR LIQUIDE AMERICAN
20 patentsUS10629451B1Apr 21, 2020
Method to improve profile control during selective etching of silicon nitride spacers
AIR LIQUIDE AMERICAN6 citations83
US8664446B1Mar 4, 2014
Purification of trimethylamine
AIR LIQUIDE AMERICAN10 citations78
US11152223B2Oct 19, 2021
Fluorocarbon molecules for high aspect ratio oxide etch
AIR LIQUIDE AMERICAN1 citations73
US10103031B2Oct 16, 2018
Chemistries for TSV/MEMS/power device etching
AIR LIQUIDE AMERICAN2 citations73
US9892932B2Feb 13, 2018
Chemistries for TSV/MEMS/power device etching
AIR LIQUIDE AMERICAN3 citations73
US11430663B2Aug 30, 2022
Iodine-containing compounds for etching semiconductor structures
AIR LIQUIDE AMERICAN3 citations72
US10607850B2Mar 31, 2020
Iodine-containing compounds for etching semiconductor structures
AIR LIQUIDE AMERICAN4 citations72
US10410878B2Sep 10, 2019
Hydrofluorocarbons containing —NH2 functional group for 3D NAND and DRAM applications
AIR LIQUIDE AMERICAN6 citations72
US9773679B2Sep 26, 2017
Method of etching semiconductor structures with etch gas
AIR LIQUIDE AMERICAN3 citations72
US12327732B2Jun 10, 2025
Method to improve profile control during selective etching of silicon nitride spacers
AIR LIQUIDE AMERICAN0 citations61
US12188123B2Jan 7, 2025
Deposition of iodine-containing carbon films
AIR LIQUIDE AMERICAN0 citations61
US11837474B2Dec 5, 2023
Method to improve profile control during selective etching of silicon nitride spacers
AIR LIQUIDE AMERICAN0 citations61
US11469110B2Oct 11, 2022
Method to improve profile control during selective etching of silicon nitride spacers
AIR LIQUIDE AMERICAN0 citations61
US12083493B2Sep 10, 2024
Selective adsorption of halocarbon impurities containing cl, br and i in fluorocarbons or hydrofluorocarbons using adsorbent supported metal oxide
AIR LIQUIDE AMERICAN0 citations52
US10720335B2Jul 21, 2020
Chemistries for TSV/MEMS/power device etching
AIR LIQUIDE AMERICAN0 citations52
US10381240B2Aug 13, 2019
Fluorocarbon molecules for high aspect ratio oxide etch
AIR LIQUIDE AMERICAN0 citations52
US10115600B2Oct 30, 2018
Method of etching semiconductor structures with etch gas
AIR LIQUIDE AMERICAN1 citations51
US12341017B2Jun 24, 2025
Etching methods with alternating non-plasma and plasma etching processes
AIR LIQUIDE AMERICAN0 citations50
US12224177B2Feb 11, 2025
Method of running an etch process in higher selectivity to mask and polymer regime by using a cyclic etch process
AIR LIQUIDE AMERICAN0 citations50
US12106971B2Oct 1, 2024
High conductive passivation layers and method of forming the same during high aspect ratio plasma etching
AIR LIQUIDE AMERICAN0 citations45
AIR LIQUIDE
5 patentsUS9514959B2Dec 6, 2016
Fluorocarbon molecules for high aspect ratio oxide etch
AIR LIQUIDE14 citations92
US10529581B2Jan 7, 2020
SiN selective etch to SiO2 with non-plasma dry process for 3D NAND device applications
AIR LIQUIDE9 citations82
US12531211B2Jan 20, 2026
Sulfur-containing molecules for high aspect ratio plasma etching processes
AIR LIQUIDE0 citations51
US12106940B2Oct 1, 2024
Systems and methods for storage and supply of F3NO-free FNO gases and F3NO-free FNO gas mixtures for semiconductor processes
AIR LIQUIDE0 citations46
US10347498B2Jul 9, 2019
Methods of minimizing plasma-induced sidewall damage during low K etch processes
AIR LIQUIDE0 citations41