Inventor
SEYAMA KOHEI
JP46 patents
⚠️ This page may combine multiple inventors who share the name “SEYAMA KOHEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHINKAWA KK
37 patentsUS11373975B2Jun 28, 2022
Electronic component mounting device
SHINKAWA KK7 citations86
US7886956B2Feb 15, 2011
Bonding apparatus and bonding stage height adjustment method for the bonding apparatus
SHINKAWA KK7 citations84
US8052026B2Nov 8, 2011
Ultrasonic horn
SHINKAWA KK4 citations74
US10492351B2Nov 26, 2019
Mounting apparatus and measuring method
SHINKAWA KK3 citations73
US9968020B2May 8, 2018
Electronic-component mounting apparatus
SHINKAWA KK2 citations73
US9536856B2Jan 3, 2017
Flip chip bonder and flip chip bonding method
SHINKAWA KK3 citations73
US9406640B2Aug 2, 2016
Flip chip bonder and method of correcting flatness and deformation amount of bonding stage
SHINKAWA KK5 citations73
US11508688B2Nov 22, 2022
Bonding apparatus including a heater and a cooling flow path used for stacking a plurality of semiconductor chips
SHINKAWA KK2 citations72
US11509126B2Nov 22, 2022
Wiring structure with movement mechanism
SHINKAWA KK3 citations71
US11469125B2Oct 11, 2022
Device and method for linearly moving first and second moving bodies relative to target object
SHINKAWA KK2 citations71
US11410866B2Aug 9, 2022
Apparatus and method for linearly moving movable body relative to object
SHINKAWA KK2 citations71
US10350692B2Jul 16, 2019
Heater for bonding apparatus and method of cooling the same
SHINKAWA KK3 citations67
US7780056B2Aug 24, 2010
Horn attachment arm
SHINKAWA KK3 citations63
US7735707B2Jun 15, 2010
Wire bonding apparatus
SHINKAWA KK4 citations63
US12112962B2Oct 8, 2024
Arrangement apparatus and arrangement method
SHINKAWA KK0 citations62
US10910248B2Feb 2, 2021
Electronic component mounting apparatus
SHINKAWA KK1 citations62
US10497590B2Dec 3, 2019
Electronic component handling unit
SHINKAWA KK1 citations62
US10477697B2Nov 12, 2019
Mounting apparatus
SHINKAWA KK1 citations62
US10340163B2Jul 2, 2019
Mounting apparatus
SHINKAWA KK1 citations62
US11664344B2May 30, 2023
Mounting apparatus
SHINKAWA KK1 citations61
US11569192B2Jan 31, 2023
Method for producing structure, and structure
SHINKAWA KK0 citations61
US11410960B2Aug 9, 2022
Bonding apparatus
SHINKAWA KK0 citations61
US11302666B2Apr 12, 2022
Mounting head
SHINKAWA KK1 citations56
US12400993B2Aug 26, 2025
Substrate holder and bonding system
SHINKAWA KK0 citations52
US12176317B2Dec 24, 2024
Semiconductor device manufacturing device and manufacturing method
SHINKAWA KK0 citations52
US12131921B2Oct 29, 2024
Manufacturing apparatus of semiconductor device
SHINKAWA KK0 citations52
US11062964B2Jul 13, 2021
Method for manufacturing semiconductor device, and mounting apparatus
SHINKAWA KK0 citations52
US10568245B2Feb 18, 2020
Electronic-component mounting apparatus
SHINKAWA KK0 citations52
US7578421B2Aug 25, 2009
Horn-holder pivot type bonding apparatus
SHINKAWA KK1 citations52
US9576927B2Feb 21, 2017
Bonding tool cooling apparatus and method for cooling bonding tool
SHINKAWA KK0 citations51
US12341035B2Jun 24, 2025
Mounting device
SHINKAWA KK0 citations50
US11769749B2Sep 26, 2023
Mounting apparatus
SHINKAWA KK0 citations50
US11139193B2Oct 5, 2021
Device and method for positioning first object in relation to second object
SHINKAWA KK0 citations50
US11749541B2Sep 5, 2023
Bonding apparatus
SHINKAWA KK0 citations48
US12191276B2Jan 7, 2025
Mounting apparatus
SHINKAWA KK0 citations47
US10181451B2Jan 15, 2019
Electronic component mounting apparatus
SHINKAWA KK0 citations42
US10137519B2Nov 27, 2018
Flux reservoir apparatus
SHINKAWA KK0 citations41
KAKUTANI OSAMU
3 patentsYAMAHA ROBOTICS CO LTD
3 patentsUS12575368B2Mar 10, 2026
Apparatus for producing semiconductor device, and method for producing semiconductor device
YAMAHA ROBOTICS CO LTD0 citations52
US12568792B2Mar 3, 2026
Semiconductor device manufacturing device and manufacturing method
YAMAHA ROBOTICS CO LTD0 citations50
US12557682B2Feb 17, 2026
Mounting device comprising semiconductor chip mounted through thermo-compression tool and mounting method thereof
YAMAHA ROBOTICS CO LTD0 citations47