Inventor

HIROTANI KOUJI

JP2 patents

Patents

2 patents

US6328196B1Dec 11, 2001

Bump bonding device and bump bonding method

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD8 citations72

US6481616B2Nov 19, 2002

Bump bonding device and bump bonding method

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD0 citations50