Inventor
CHIU CHIH-YUAN
TW5 patents
Patents
5 patentsUS12009337B2Jun 11, 2024
Bonding tool and bonding method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations66
US12438118B2Oct 7, 2025
Bonding tool and bonding method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations56
US12362317B2Jul 15, 2025
Semiconductor die dipping structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations55
US12506109B2Dec 23, 2025
Die bonding tool with tiltable bond head for improved bonding and methods for performing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations49
US10312118B2Jun 4, 2019
Bonding apparatus and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations36