Inventor
CHEN SHIH-YEN
TW13 patents
⚠️ This page may combine multiple inventors who share the name “CHEN SHIH-YEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
8 patentsUS12009337B2Jun 11, 2024
Bonding tool and bonding method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations66
US11984419B2May 14, 2024
Package structure with a barrier layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US11469203B2Oct 11, 2022
Method for forming package structure with a barrier layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US11000923B2May 11, 2021
Tool and method of reflow
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations57
US12438118B2Oct 7, 2025
Bonding tool and bonding method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations56
US10811377B2Oct 20, 2020
Package structure with a barrier layer and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations49
US9808891B2Nov 7, 2017
Tool and method of reflow
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations47
US10861761B2Dec 8, 2020
Semiconductor packaged wafer and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations38