Inventor
ELSHERBINI ADEL
US73 patents
Patents
50 patentsUS9915978B2Mar 13, 2018
Method of fabricating a stretchable computing device
INTEL CORP35 citations92
US11688665B2Jun 27, 2023
Thermal management solutions for stacked integrated circuit devices
INTEL CORP7 citations86
US10943851B1Mar 9, 2021
Reconstituted wafer assembly
INTEL CORP18 citations86
US10658312B2May 19, 2020
Embedded millimeter-wave phased array module
INTEL CORP11 citations86
US11476554B2Oct 18, 2022
Mmwave waveguide to waveguide connectors for automotive applications
INTEL CORP9 citations84
US11270947B2Mar 8, 2022
Composite interposer structure and method of providing same
INTEL CORP5 citations84
US11094672B2Aug 17, 2021
Composite IC chips including a chiplet embedded within metallization layers of a host IC chip
INTEL CORP5 citations84
US11049791B1Jun 29, 2021
Heat spreading layer integrated within a composite IC die structure and methods of forming the same
INTEL CORP7 citations84
US9832863B2Nov 28, 2017
Method of fabricating a stretchable computing device
INTEL CORP10 citations84
US9773742B2Sep 26, 2017
Embedded millimeter-wave phased array module
INTEL CORP15 citations84
US9659904B2May 23, 2017
Distributed on-package millimeter-wave radio
INTEL CORP5 citations84
US11183477B2Nov 23, 2021
Mixed hybrid bonding structures and methods of forming the same
INTEL CORP6 citations83
US11652059B2May 16, 2023
Composite interposer structure and method of providing same
INTEL CORP5 citations82
US11482472B2Oct 25, 2022
Thermal management solutions for stacked integrated circuit devices
INTEL CORP6 citations75
US12288750B2Apr 29, 2025
Conformal power delivery structure for direct chip attach architectures
INTEL CORP2 citations74
US12224261B2Feb 11, 2025
Mixed hybrid bonding structures and methods of forming the same
INTEL CORP2 citations73
US11621208B2Apr 4, 2023
Thermal management solutions that reduce inductive coupling between stacked integrated circuit devices
INTEL CORP2 citations73
US11417586B2Aug 16, 2022
Thermal management solutions for substrates in integrated circuit packages
INTEL CORP2 citations73
US11394094B2Jul 19, 2022
Waveguide connector having a curved array of waveguides configured to connect a package to excitation elements
INTEL CORP2 citations73
US11309619B2Apr 19, 2022
Waveguide coupling systems and methods
INTEL CORP2 citations73
US11234343B2Jan 25, 2022
Thermal management solutions for stacked integrated circuit devices using unidirectional heat transfer devices
INTEL CORP2 citations73
US10734735B2Aug 4, 2020
Distributed on-package millimeter-wave radio
INTEL CORP2 citations73
US10326211B2Jun 18, 2019
Distributed on-package millimeter-wave radio
INTEL CORP2 citations73
US11189585B2Nov 30, 2021
Selective recess of interconnects for probing hybrid bond devices
INTEL CORP3 citations72
US11205630B2Dec 21, 2021
Vias in composite IC chip structures
INTEL CORP3 citations71
US9635764B2Apr 25, 2017
Integrated circuit and method that utilize a shape memory material
INTEL CORP4 citations68
US12266840B2Apr 1, 2025
Waveguide interconnects for semiconductor packages and related methods
INTEL CORP1 citations64
US12519073B2Jan 6, 2026
Conformal power delivery structures of 3D stacked die assemblies
INTEL CORP0 citations63
US12487420B2Dec 2, 2025
Apparatus and method of manufacturing a vertically disaggregated photonic device
INTEL CORP0 citations63
US12438087B2Oct 7, 2025
High throughput additive manufacturing for integrated circuit components containing traces with feature size and grain boundaries
INTEL CORP0 citations63
US12431430B2Sep 30, 2025
Technologies for high throughput additive manufacturing for integrated circuit components
INTEL CORP0 citations63
US12300579B2May 13, 2025
Liquid cooled interposer for integrated circuit stack
INTEL CORP0 citations63
US12142543B2Nov 12, 2024
Thermal management solutions for embedded integrated circuit devices
INTEL CORP0 citations63
US11933555B2Mar 19, 2024
Heat dissipation device having anisotropic thermally conductive sections and isotropic thermally conductive sections
INTEL CORP1 citations63
US11842826B2Dec 12, 2023
Additive manufacturing for integrated circuit assembly connector support structures
INTEL CORP0 citations63
US11615998B2Mar 28, 2023
Thermal management solutions for embedded integrated circuit devices
INTEL CORP0 citations63
US11342243B2May 24, 2022
Thermal management solutions for embedded integrated circuit devices
INTEL CORP0 citations63
US11226162B2Jan 18, 2022
Heat dissipation device having anisotropic thermally conductive sections and isotropic thermally conductive sections
INTEL CORP0 citations63
US12424543B2Sep 23, 2025
Selective interconnects in back-end-of-line metallization stacks of integrated circuitry
INTEL CORP0 citations62
US12362284B2Jul 15, 2025
Composite interposer structure and method of providing same
INTEL CORP0 citations62
US12327775B2Jun 10, 2025
Thermal performance in hybrid bonded 3D die stacks
INTEL CORP0 citations62
US12199012B2Jan 14, 2025
Modular microchannel thermal solutions for integrated circuit devices
INTEL CORP0 citations62
US12170244B2Dec 17, 2024
High-throughput additively manufactured power delivery vias and traces
INTEL CORP0 citations62
US12040307B2Jul 16, 2024
Magnetic induced heating for solder interconnects
INTEL CORP0 citations62
US12014990B2Jun 18, 2024
Composite interposer structure and method of providing same
INTEL CORP0 citations62
US11895815B2Feb 6, 2024
Additive manufacturing for integrated circuit assembly cables
INTEL CORP0 citations62
US11887944B2Jan 30, 2024
Additive manufacturing for integrated circuit assembly connectors
INTEL CORP0 citations62
US11749649B2Sep 5, 2023
Composite IC chips including a chiplet embedded within metallization layers of a host IC chip
INTEL CORP0 citations62
US11581238B2Feb 14, 2023
Heat spreading layer integrated within a composite IC die structure and methods of forming the same
INTEL CORP0 citations62
US10998302B2May 4, 2021
Packaged device with a chiplet comprising memory resources
INTEL CORP0 citations62
Showing the top 50 of 73 patents by PatentIndex Score.