Inventor
LIN YU LING
TW81 patents
⚠️ This page may combine multiple inventors who share the name “LIN YU LING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
EPISTAR CORP
15 patentsUS11658269B2May 23, 2023
Light-emitting device
EPISTAR CORP2 citations73
US10749075B2Aug 18, 2020
Semiconductor light-emitting device
EPISTAR CORP4 citations73
US10680138B2Jun 9, 2020
Light-emitting device
EPISTAR CORP1 citations73
US11063087B2Jul 13, 2021
Light-emitting device
EPISTAR CORP2 citations72
US9893241B2Feb 13, 2018
Light emitting device having bonding pads formed therein for packaging
EPISTAR CORP1 citations63
US12557463B2Feb 17, 2026
Light emitting device
EPISTAR CORP0 citations62
US12283606B2Apr 22, 2025
Light-emitting device
EPISTAR CORP0 citations62
US12176465B2Dec 24, 2024
Light-emitting device
EPISTAR CORP0 citations62
US12166156B2Dec 10, 2024
Semiconductor light-emitting device
EPISTAR CORP0 citations62
US12002842B2Jun 4, 2024
Light emitting device and manufacturing method thereof
EPISTAR CORP0 citations62
US11942509B2Mar 26, 2024
Light-emitting device
EPISTAR CORP0 citations62
US11894491B2Feb 6, 2024
Semiconductor light-emitting device
EPISTAR CORP0 citations62
US11764332B2Sep 19, 2023
Semiconductor light-emitting device
EPISTAR CORP0 citations62
US11329195B2May 10, 2022
Semiconductor light-emitting device
EPISTAR CORP0 citations62
US10985295B2Apr 20, 2021
Light-emitting device
EPISTAR CORP0 citations62
TAIWAN SEMICONDUCTOR MFG CO LTD
13 patentsUS10840201B2Nov 17, 2020
Methods and apparatus for transmission lines in packages
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10629756B2Apr 21, 2020
Semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10269746B2Apr 23, 2019
Methods and apparatus for transmission lines in packages
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10192833B2Jan 29, 2019
Interposer and semiconductor package with noise suppression features
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9461048B2Oct 4, 2016
Meander line resistor structure
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9219039B2Dec 22, 2015
Interposer and semiconductor package with noise suppression features
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US9728847B2Aug 8, 2017
On-chip helix antenna
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US11978712B2May 7, 2024
Method of forming semiconductor package transmission lines with micro-bump lines
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11145767B2Oct 12, 2021
Semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US9385246B2Jul 5, 2016
Differential MOSCAP device
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations63
US8975979B2Mar 10, 2015
Transformer with bypass capacitor
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations63
US11410952B2Aug 9, 2022
Filter and capacitor using redistribution layer and micro bump layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10971296B2Apr 6, 2021
Compact vertical inductors extending in vertical planes
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
YEN HSIAO-TSUNG
9 patentsUS8754818B2Jun 17, 2014
Integrated antenna structure on separate semiconductor die
YEN HSIAO-TSUNG41 citations94
US8610247B2Dec 17, 2013
Structure and method for a transformer with magnetic features
YEN HSIAO-TSUNG13 citations92
US8552812B2Oct 8, 2013
Transformer with bypass capacitor
YEN HSIAO-TSUNG23 citations92
US8860114B2Oct 14, 2014
Structure and method for a fishbone differential capacitor
YEN HSIAO-TSUNG18 citations84
US8580647B2Nov 12, 2013
Inductors with through VIAS
YEN HSIAO-TSUNG7 citations84
US8399961B2Mar 19, 2013
Tuning the efficiency in the transmission of radio-frequency signals using micro-bumps
YEN HSIAO-TSUNG11 citations84
US8809073B2Aug 19, 2014
Apparatus and methods for de-embedding through substrate vias
YEN HSIAO-TSUNG12 citations83
US9633149B2Apr 25, 2017
System and method for modeling through silicon via
YEN HSIAO-TSUNG6 citations73
US9087838B2Jul 21, 2015
Structure and method for a high-K transformer with capacitive coupling
YEN HSIAO-TSUNG2 citations63
TAIWAN SEMICONDUCTOR MFG
5 patentsUS9171798B2Oct 27, 2015
Methods and apparatus for transmission lines in packages
TAIWAN SEMICONDUCTOR MFG23 citations93
US8896094B2Nov 25, 2014
Methods and apparatus for inductors and transformers in packages
TAIWAN SEMICONDUCTOR MFG28 citations92
US9203146B2Dec 1, 2015
Antenna using through-silicon via
TAIWAN SEMICONDUCTOR MFG4 citations73
US8901714B2Dec 2, 2014
Transmission line formed adjacent seal ring
TAIWAN SEMICONDUCTOR MFG3 citations63
US8901752B2Dec 2, 2014
Tuning the efficiency in the transmission of radio-frequency signals using micro-bumps
TAIWAN SEMICONDUCTOR MFG3 citations63
LIN YU-LING
3 patentsAUO CORP
2 patentsHUNG CHENG-HSIEN
1 patentYEN HSIAO TSUNG
1 patentHEWLETT PACKARD DEVELOPMENT CO
1 patentShowing the top 50 of 81 patents by PatentIndex Score.