Inventor
FUTATSUKA RENSEI
JP9 patents
⚠️ This page may combine multiple inventors who share the name “FUTATSUKA RENSEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI SHINDO KK
8 patentsUS5667752ASep 16, 1997
Copper alloy sheet for connectors and connectors formed of same
MITSUBISHI SHINDO KK23 citations91
US5510197AApr 23, 1996
Lead frame material and lead frame for semiconductor device
MITSUBISHI SHINDO KK51 citations90
US5463247AOct 31, 1995
Lead frame material formed of copper alloy for resin sealed type semiconductor devices
MITSUBISHI SHINDO KK19 citations81
US4668471AMay 26, 1987
Copper alloy lead material for leads of a semiconductor device
MITSUBISHI SHINDO KK18 citations77
US5997810ADec 7, 1999
High-strength copper based alloy free from smutting during pretreatment for plating
MITSUBISHI SHINDO KK8 citations72
US4750029AJun 7, 1988
Copper base lead material for leads of semiconductor devices
MITSUBISHI SHINDO KK15 citations72
US5885376AMar 23, 1999
Corrosion-resistant high-strength copper based alloy having excellent blankability
MITSUBISHI SHINDO KK16 citations70
US4877577AOct 31, 1989
Copper alloy lead frame material for semiconductor devices
MITSUBISHI SHINDO KK13 citations68