Inventor
DESAI KISHOR V
US43 patents
⚠️ This page may combine multiple inventors who share the name “DESAI KISHOR V”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
23 patentsUS6224396B1May 1, 2001
Compliant, surface-mountable interposer
IBM91 citations98
US5159535AOct 27, 1992
Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate
IBM145 citations98
US5137456AAug 11, 1992
High density, separable connector and contact for use therein
IBM156 citations98
US6002172ADec 14, 1999
Substrate structure and method for improving attachment reliability of semiconductor chips and modules
IBM98 citations97
US6281581B1Aug 28, 2001
Substrate structure for improving attachment reliability of semiconductor chips and modules
IBM70 citations96
US5880590AMar 9, 1999
Apparatus and method for burn-in and testing of devices with solder bumps or preforms
IBM93 citations96
US5199879AApr 6, 1993
Electrical assembly with flexible circuit
IBM156 citations96
US4788767ADec 6, 1988
Method for mounting a flexible film semiconductor chip carrier on a circuitized substrate
IBM77 citations96
US6552266B2Apr 22, 2003
High performance chip packaging and method
IBM96 citations95
US5201451AApr 13, 1993
Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate
IBM82 citations94
US6251766B1Jun 26, 2001
Method for improving attachment reliability of semiconductor chips and modules
IBM23 citations92
US5170931ADec 15, 1992
Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate
IBM52 citations92
US5604445AFeb 18, 1997
Apparatus, and corresponding method, for stress testing semiconductor chips
IBM22 citations91
US5479703AJan 2, 1996
Method of making a printed circuit board or card
IBM46 citations91
US5435480AJul 25, 1995
Method for filling plated through holes
IBM67 citations91
US5259781ANov 9, 1993
Electrical connector alignment and actuation assembly
IBM34 citations91
US5497103AMar 5, 1996
Test apparatus for circuitized substrate
IBM20 citations83
US6552264B2Apr 22, 2003
High performance chip packaging and method
IBM9 citations71
US4558590ADec 17, 1985
Method for measuring the real contact area in connectors
IBM6 citations71
US6272742B1Aug 14, 2001
Method of electrically connecting substrates using solder balls
IBM9 citations69
US6023029AFeb 8, 2000
Use of blind vias for soldered interconnections between substrates and printed wiring boards
IBM6 citations69
US6452116B2Sep 17, 2002
Use of blind vias for soldered interconnections between substrates and printed wiring boards
IBM1 citations60
US6655020B2Dec 2, 2003
Method of packaging a high performance chip
IBM0 citations49
LSI LOGIC CORP
10 patentsUS6335491B1Jan 1, 2002
Interposer for semiconductor package assembly
LSI LOGIC CORP129 citations98
US6166434ADec 26, 2000
Die clip assembly for semiconductor package
LSI LOGIC CORP128 citations97
US6618938B1Sep 16, 2003
Interposer for semiconductor package assembly
LSI LOGIC CORP31 citations92
US6306751B1Oct 23, 2001
Apparatus and method for improving ball joints in semiconductor packages
LSI LOGIC CORP27 citations92
US6002171ADec 14, 1999
Integrated heat spreader/stiffener assembly and method of assembly for semiconductor package
LSI LOGIC CORP38 citations92
US7119432B2Oct 10, 2006
Method and apparatus for establishing improved thermal communication between a die and a heatspreader in a semiconductor package
LSI LOGIC CORP42 citations87
US6431432B1Aug 13, 2002
Method for attaching solderballs by selectively oxidizing traces
LSI LOGIC CORP29 citations86
US6266249B1Jul 24, 2001
Semiconductor flip chip ball grid array package
LSI LOGIC CORP8 citations74
US6433565B1Aug 13, 2002
Test fixture for flip chip ball grid array circuits
LSI LOGIC CORP10 citations73
US6465338B1Oct 15, 2002
Method of planarizing die solder balls by employing a die's weight
LSI LOGIC CORP1 citations51