Inventor
KAWAKAMI HIROMICHI
JP25 patents
⚠️ This page may combine multiple inventors who share the name “KAWAKAMI HIROMICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MURATA MANUFACTURING CO
24 patentsUS6426551B1Jul 30, 2002
Composite monolithic electronic component
MURATA MANUFACTURING CO35 citations92
US6938332B2Sep 6, 2005
Method for manufacturing multilayer ceramic substrates
MURATA MANUFACTURING CO31 citations91
US6444598B1Sep 3, 2002
Insulator composition, insulator paste and laminated electronic part
MURATA MANUFACTURING CO14 citations84
US6365265B1Apr 2, 2002
Photosensitive insulating paste and thick-film multi-layer circuit substrate
MURATA MANUFACTURING CO14 citations83
US5766741AJun 16, 1998
Insulating paste and thick-film multi-layered printed circuit using the paste
MURATA MANUFACTURING CO16 citations82
US7569177B2Aug 4, 2009
Method of producing ceramic multilayer substrates, and green composite laminate
MURATA MANUFACTURING CO10 citations80
US6270880B1Aug 7, 2001
Crystalline glass composition for use in circuit board, sintered crystalline glass, insulator composition insulating paste and thick film circuit board
MURATA MANUFACTURING CO6 citations74
US5814571ASep 29, 1998
Dielectric paste and thick-film capacitor using same
MURATA MANUFACTURING CO11 citations74
US5710082AJan 20, 1998
Glass composition having a low dielectric constant for high-frequency circuits
MURATA MANUFACTURING CO13 citations74
US5702996ADec 30, 1997
Insulation paste containing glass
MURATA MANUFACTURING CO9 citations74
US11067600B2Jul 20, 2021
Multilayer circuit board used for probe card and probe card including multilayer circuit board
MURATA MANUFACTURING CO5 citations72
US10499506B2Dec 3, 2019
Composite substrate and method for manufacturing composite substrate
MURATA MANUFACTURING CO2 citations70
US7001569B2Feb 21, 2006
Method of manufacturing ceramic multi-layer substrate, and unbaked composite laminated body
MURATA MANUFACTURING CO9 citations69
US6534161B1Mar 18, 2003
Crystallized glass composition, sintered crystallized glass compact, and circuit substrate using the same
MURATA MANUFACTURING CO5 citations63
US6007900ADec 28, 1999
Dielectric paste and thick-film capacitor using same
MURATA MANUFACTURING CO2 citations63
US5968858AOct 19, 1999
Insulating paste and thick-film multi-layered printed circuit using the paste
MURATA MANUFACTURING CO4 citations63
US6942833B2Sep 13, 2005
Ceramic multilayer substrate manufacturing method and unfired composite multilayer body
MURATA MANUFACTURING CO4 citations62
US6596382B2Jul 22, 2003
Multilayered board and method for fabricating the same
MURATA MANUFACTURING CO5 citations62
US6403694B1Jun 11, 2002
Photosensitive insulating paste and thick film multi-layer circuit substrate
MURATA MANUFACTURING CO4 citations62
US6316374B1Nov 13, 2001
Dielectric ceramic composition and ceramic electronic element produced from the same
MURATA MANUFACTURING CO5 citations62
US6118649ASep 12, 2000
Dielectric paste and thick film capacitor using the same
MURATA MANUFACTURING CO1 citations52
US6602946B2Aug 5, 2003
Photosensitive insulating paste and thick film multi-layer circuit substrate
MURATA MANUFACTURING CO1 citations51
US10638603B2Apr 28, 2020
Multilayer ceramic substrate
MURATA MANUFACTURING CO0 citations48
US10485099B2Nov 19, 2019
Multilayer ceramic substrate
MURATA MANUFACTURING CO0 citations48