P

Inventor

HAUSMANN GILBERT

US19 patents
⚠️ This page may combine multiple inventors who share the name “HAUSMANN GILBERT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

APPLIED MATERIALS INC

14 patents
US6099697AAug 8, 2000

Method of and apparatus for restoring a support surface in a semiconductor wafer processing system

APPLIED MATERIALS INC313 citations99
US6743473B1Jun 1, 2004

Chemical vapor deposition of barriers from novel precursors

APPLIED MATERIALS INC400 citations98
US6475902B1Nov 5, 2002

Chemical vapor deposition of niobium barriers for copper metallization

APPLIED MATERIALS INC380 citations98
US5886866AMar 23, 1999

Electrostatic chuck having a combination electrode structure for substrate chucking, heating and biasing

APPLIED MATERIALS INC114 citations98
US6117246ASep 12, 2000

Conductive polymer pad for supporting a workpiece upon a workpiece support surface of an electrostatic chuck

APPLIED MATERIALS INC50 citations96
US6219219B1Apr 17, 2001

Cathode assembly containing an electrostatic chuck for retaining a wafer in a semiconductor wafer processing system

APPLIED MATERIALS INC63 citations93
US6057244AMay 2, 2000

Method for improved sputter etch processing

APPLIED MATERIALS INC68 citations93
US6215640B1Apr 10, 2001

Apparatus and method for actively controlling surface potential of an electrostatic chuck

APPLIED MATERIALS INC35 citations92
US6163448ADec 19, 2000

Apparatus and method for ex-situ testing of performance parameters on an electrostatic chuck

APPLIED MATERIALS INC21 citations92
US6104596AAug 15, 2000

Apparatus for retaining a subtrate in a semiconductor wafer processing system and a method of fabricating same

APPLIED MATERIALS INC50 citations92
US6067222AMay 23, 2000

Substrate support apparatus and method for fabricating same

APPLIED MATERIALS INC35 citations92
US5880923AMar 9, 1999

Method and apparatus for improved retention of a semiconductor wafer within a semiconductor wafer processing system

APPLIED MATERIALS INC47 citations92
US6547934B2Apr 15, 2003

Reduction of metal oxide in a dual frequency etch chamber

APPLIED MATERIALS INC9 citations74
US6908865B2Jun 21, 2005

Method and apparatus for cleaning substrates

APPLIED MATERIALS INC10 citations71

COVIDIEN LP

3 patents

NELLCOR PURITAN BENNETT LLC

1 patent

HAUSMANN GILBERT

1 patent