Inventor

PALMER BENTLEY J

US15 patents

⚠️ This page may combine multiple inventors who share the name “PALMER BENTLEY J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SCHLUMBERGER TECHNOLOGY CORP

4 patents

US6599863B1Jul 29, 2003

Fracturing process and composition

SCHLUMBERGER TECHNOLOGY CORP421 citations98

US6419019B1Jul 16, 2002

Method to remove particulate matter from a wellbore using translocating fibers and/or platelets

SCHLUMBERGER TECHNOLOGY CORP65 citations96

US6085844AJul 11, 2000

Method for removal of undesired fluids from a wellbore

SCHLUMBERGER TECHNOLOGY CORP60 citations96

US6608005B2Aug 19, 2003

Wellbore fluids and their application

SCHLUMBERGER TECHNOLOGY CORP34 citations90

SHI XIAOBO

3 patents

US8697577B2Apr 15, 2014

Method and composition for chemical mechanical planarization of a metal or a metal alloy

SHI XIAOBO0 citations49

US8252688B2Aug 28, 2012

Method and composition for chemical mechanical planarization of a metal or a metal alloy

SHI XIAOBO1 citations49

US8414789B2Apr 9, 2013

Method and composition for chemical mechanical planarization of a metal

SHI XIAOBO1 citations46

UNIV FRASER SIMON

1 patent

US5534312AJul 9, 1996

Method for directly depositing metal containing patterned films

UNIV FRASER SIMON172 citations93

(unassigned)

1 patent

US6924253B2Aug 2, 2005

Scale removal

37 citations91

SPEEDFAM IPEC CORP

1 patent

US6802955B2Oct 12, 2004

Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surface

SPEEDFAM IPEC CORP43 citations91

DUPONT AIR PROD NANOMATERIALS

1 patent

US7678605B2Mar 16, 2010

Method for chemical mechanical planarization of chalcogenide materials

DUPONT AIR PROD NANOMATERIALS10 citations83

TOKYO ELECTRON LTD

1 patent

US7064070B2Jun 20, 2006

Removal of CMP and post-CMP residue from semiconductors using supercritical carbon dioxide process

TOKYO ELECTRON LTD17 citations83

NOVELLUS SYSTEMS INC

1 patent

US7297239B2Nov 20, 2007

Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surface

NOVELLUS SYSTEMS INC11 citations82

AIR PROD & CHEM

1 patent

US8841216B2Sep 23, 2014

Method and composition for chemical mechanical planarization of a metal

AIR PROD & CHEM2 citations57

SAWAYDA REBECCA A

1 patent

US8506661B2Aug 13, 2013

Polishing slurry for copper films

SAWAYDA REBECCA A0 citations42