Inventor
CARTER JR BUFORD H
US8 patents
Patents
8 patentsUS6211462B1Apr 3, 2001
Low inductance power package for integrated circuits
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US6365980B1Apr 2, 2002
Thermally enhanced semiconductor ball grid array device and method of fabrication
TEXAS INSTRUMENTS INC76 citations95
US6365976B1Apr 2, 2002
Integrated circuit device with depressions for receiving solder balls and method of fabrication
TEXAS INSTRUMENTS INC28 citations92
US5594234AJan 14, 1997
Downset exposed die mount pad leadframe and package
TEXAS INSTRUMENTS INC87 citations92
US6072230AJun 6, 2000
Exposed leadframe for semiconductor packages and bend forming method of fabrication
TEXAS INSTRUMENTS INC22 citations87
US5376909ADec 27, 1994
Device packaging
TEXAS INSTRUMENTS INC37 citations87
US6401765B1Jun 11, 2002
Lead frame tooling design for exposed pad features
TEXAS INSTRUMENTS INC15 citations83
US6465274B2Oct 15, 2002
Lead frame tooling design for bleed barrier groove
TEXAS INSTRUMENTS INC7 citations73