Inventor

Lin da-jun

TW53 patents

⚠️ This page may combine multiple inventors who share the name “Lin da-jun”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

Lin da-jun

UNITED MICROELECTRONICS CORP

Semiconductor device and method to fabricate the semiconductor device

Semiconductor device and method for fabricating the same

Semiconductor structure and manufacturing method thereof

Semiconductor device

Interposer having inductor coil pattern embedded in buffer layer and fabrication thereof

Semiconductor device and manufacturing method thereof

MIM capacitor and fabricating method of the same

Semiconductor device and method for manufacturing the same

MIM capacitor structure and fabricating method of the same

Semiconductor device and method for fabricating the same

Semiconductor device and method for fabricating the same

Semiconductor device and method for fabricating the same

Semiconductor device and method for fabricating the same

Semiconductor structure

Method for fabricating memory cell of magnetoresistive random access memory

Metal interconnect structure and method for fabricating the same

Method of manufacturing magnetic tunnel junction (MTJ) device

Semiconductor device and method for fabricating the same

Semiconductor device and method for fabricating the same

Magnetic tunnel junction (MTJ) device

Magnetoresistive random access memory device and method for fabricating the same

Semiconductor device and method for fabricating the same

Magnetoresistive random access memory and method for fabricating the same

Metal interconnect structure and method for fabricating the same

Semiconductor structure and the forming method thereof

Method for fabricating semiconductor device

Warpage-reducing semiconductor structure and fabricating method of the same

Method for fabricating semiconductor device

Manufacturing method of memory device

Warpage-reducing semiconductor structure and fabricating method of the same

MRAM structure and method of fabricating the same

HEMT and method of fabricating the same

Method for fabricating semiconductor device

Fabricating method of reducing photoresist footing

Memory device and manufacturing method thereof

HEMT and method of fabricating the same

MRAM structure and method of fabricating the same

Chip bonding alignment structure, chip bonding structure and methods for fabricating the same

Semiconductor device

Method of forming memory cell

Memory cell and forming method thereof

Semiconductor device and method for fabricating the same

Method for forming ohmic contacts on compound semiconductor devices

Compound semiconductor device and fabrication method thereof

Semiconductor device including III-V compound semiconductor layer and manufacturing method thereof

Structure with photodiode, high electron mobility transistor, surface acoustic wave device and fabricating method of the same

MRAM structure and fabricating method of the same

Gallium nitride device with field plate structure and method of manufacturing the same

Magnetic random access memory structure

ORIENTAL SYSTEM TECHNOLOGY INC

Infrared thermopile sensor