Inventor
YEH SHING
US14 patents
⚠️ This page may combine multiple inventors who share the name “YEH SHING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DELPHI TECH INC
10 patentsUS6281106B1Aug 28, 2001
Method of solder bumping a circuit component
DELPHI TECH INC106 citations95
US6062461AMay 16, 2000
Process for bonding micromachined wafers using solder
DELPHI TECH INC196 citations94
US6251501B1Jun 26, 2001
Surface mount circuit device and solder bumping method therefor
DELPHI TECH INC66 citations93
US6811892B2Nov 2, 2004
Lead-based solder alloys containing copper
DELPHI TECH INC19 citations92
US6630251B1Oct 7, 2003
Leach-resistant solder alloys for silver-based thick-film conductors
DELPHI TECH INC21 citations91
US6767411B2Jul 27, 2004
Lead-free solder alloy and solder reflow process
DELPHI TECH INC43 citations88
US7726972B1Jun 1, 2010
Liquid metal rotary connector apparatus for a vehicle steering wheel and column
DELPHI TECH INC17 citations84
US6570260B1May 27, 2003
Solder process and solder alloy therefor
DELPHI TECH INC13 citations83
US7447041B2Nov 4, 2008
Compression connection for vertical IC packages
DELPHI TECH INC3 citations62
US6619536B2Sep 16, 2003
Solder process and solder alloy therefor
DELPHI TECH INC3 citations62
DELCO ELECTRONICS CORP
4 patentsUS5607099AMar 4, 1997
Solder bump transfer device for flip chip integrated circuit devices
DELCO ELECTRONICS CORP219 citations96
US5803340ASep 8, 1998
Composite solder paste for flip chip bumping
DELCO ELECTRONICS CORP114 citations95
US5491364AFeb 13, 1996
Reduced stress terminal pattern for integrated circuit devices and packages
DELCO ELECTRONICS CORP54 citations94
US5938862AAug 17, 1999
Fatigue-resistant lead-free alloy
DELCO ELECTRONICS CORP39 citations87