Inventor

STEPNIAK FRANK

US23 patents

⚠️ This page may combine multiple inventors who share the name “STEPNIAK FRANK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

STEPNIAK FRANK

TEXAS INSTRUMENTS INC

Conductive through-polymer vias for capacitative structures integrated with packaged semiconductor chips

Electronic device package with vertically integrated capacitors

Electronic assembly with three dimensional inkjet printed traces

Integrated circuit package with printed circuit layer

Method for embedding controlled-cavity MEMS package in integration board

Discrete device mounted on substrate

Integrated circuit package with printed circuit layer

Conductive through-polymer vias for capacitative structures integrated with packaged semiconductor chips

DELPHI TECH INC

Method of solder bumping a circuit component

No-flow underfill process and material therefor

Lead-based solder alloys containing copper

Conductive adhesive material with metallurgically-bonded conductive particles

Surface bumping method and structure formed thereby

Wafer-applied underfill process

Flip-chip interconnected with increased current-carrying capability

THOMAS & BETTS INT

Elbow canister fuseholder

Encapsulated fuse with corona shield

High current switch and method of operation

High current switch and method of operation

High current switch and method of operation

MANACK CHRISTOPHER D

Methods for embedding controlled-cavity MEMS package in integration board

ROMIG MATTHEW DAVID

Electronic assembly with three dimensional inkjet printed traces

AT & T BELL LAB

Pseudo-electroless, followed by electroless, metallization of nickel on metallic wires, as for semiconductor chip-to-chip interconnections