Inventor
TOMIMORI HIROAKI
JP20 patents
⚠️ This page may combine multiple inventors who share the name “TOMIMORI HIROAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NEC ELECTRONICS CORP
15 patentsUS7138362B2Nov 21, 2006
Washing liquid composition for semiconductor substrate
NEC ELECTRONICS CORP23 citations92
US6592677B1Jul 15, 2003
Method of forming a semiconductor device by simultaneously cleaning both sides of a wafer using different cleaning solutions
NEC ELECTRONICS CORP31 citations92
US6998352B2Feb 14, 2006
Cleaning method, method for fabricating semiconductor device and cleaning solution
NEC ELECTRONICS CORP14 citations84
US6897150B1May 24, 2005
Semiconductor wafer surface and method of treating a semiconductor wafer surface
NEC ELECTRONICS CORP13 citations84
US6864187B2Mar 8, 2005
Method of washing a semiconductor wafer
NEC ELECTRONICS CORP14 citations84
US7268087B2Sep 11, 2007
Manufacturing method of semiconductor device
NEC ELECTRONICS CORP10 citations83
US7170172B2Jan 30, 2007
Semiconductor device having a roughened surface
NEC ELECTRONICS CORP14 citations83
US7087562B2Aug 8, 2006
Post-CMP washing liquid composition
NEC ELECTRONICS CORP16 citations83
US6890864B2May 10, 2005
Semiconductor device fabricating method and treating liquid
NEC ELECTRONICS CORP12 citations83
US7312160B2Dec 25, 2007
Removing solution, cleaning method for semiconductor substrate, and process for production of semiconductor device
NEC ELECTRONICS CORP6 citations74
US6797648B2Sep 28, 2004
Cleaning water for cleaning a wafer and method of cleaning a wafer
NEC ELECTRONICS CORP7 citations74
US7560372B2Jul 14, 2009
Process for making a semiconductor device having a roughened surface
NEC ELECTRONICS CORP5 citations73
US7718532B2May 18, 2010
Method of forming a high-k film on a semiconductor device
NEC ELECTRONICS CORP0 citations52
US7592266B2Sep 22, 2009
Removing solution, cleaning method for semiconductor substrate, and process for production of semiconductor device
NEC ELECTRONICS CORP1 citations52
US7786005B2Aug 31, 2010
Method for manufacturing semiconductor device to form a via hole
NEC ELECTRONICS CORP1 citations45