P

Inventor

TOMIMORI HIROAKI

JP20 patents
⚠️ This page may combine multiple inventors who share the name “TOMIMORI HIROAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NEC ELECTRONICS CORP

15 patents
US7138362B2Nov 21, 2006

Washing liquid composition for semiconductor substrate

NEC ELECTRONICS CORP23 citations92
US6592677B1Jul 15, 2003

Method of forming a semiconductor device by simultaneously cleaning both sides of a wafer using different cleaning solutions

NEC ELECTRONICS CORP31 citations92
US6998352B2Feb 14, 2006

Cleaning method, method for fabricating semiconductor device and cleaning solution

NEC ELECTRONICS CORP14 citations84
US6897150B1May 24, 2005

Semiconductor wafer surface and method of treating a semiconductor wafer surface

NEC ELECTRONICS CORP13 citations84
US6864187B2Mar 8, 2005

Method of washing a semiconductor wafer

NEC ELECTRONICS CORP14 citations84
US7268087B2Sep 11, 2007

Manufacturing method of semiconductor device

NEC ELECTRONICS CORP10 citations83
US7170172B2Jan 30, 2007

Semiconductor device having a roughened surface

NEC ELECTRONICS CORP14 citations83
US7087562B2Aug 8, 2006

Post-CMP washing liquid composition

NEC ELECTRONICS CORP16 citations83
US6890864B2May 10, 2005

Semiconductor device fabricating method and treating liquid

NEC ELECTRONICS CORP12 citations83
US7312160B2Dec 25, 2007

Removing solution, cleaning method for semiconductor substrate, and process for production of semiconductor device

NEC ELECTRONICS CORP6 citations74
US6797648B2Sep 28, 2004

Cleaning water for cleaning a wafer and method of cleaning a wafer

NEC ELECTRONICS CORP7 citations74
US7560372B2Jul 14, 2009

Process for making a semiconductor device having a roughened surface

NEC ELECTRONICS CORP5 citations73
US7718532B2May 18, 2010

Method of forming a high-k film on a semiconductor device

NEC ELECTRONICS CORP0 citations52
US7592266B2Sep 22, 2009

Removing solution, cleaning method for semiconductor substrate, and process for production of semiconductor device

NEC ELECTRONICS CORP1 citations52
US7786005B2Aug 31, 2010

Method for manufacturing semiconductor device to form a via hole

NEC ELECTRONICS CORP1 citations45

NEC CORP

3 patents

KANTO KAGAKU

1 patent

SUMITOMO CHEMICAL CO

1 patent