Inventor

CHEN SHIH-WEI

TW55 patents

⚠️ This page may combine multiple inventors who share the name “CHEN SHIH-WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHEN SHIH-WEI

TAIWAN SEMICONDUCTOR MFG CO LTD

Semicondcutor package and method of manufacturing the same

Package structure and method of manufacturing the same

Semiconductor package and method of manufacturing the same

Semiconductor device having a heat dissipation structure connected chip package

Package structure and method of manufacturing the same

Semiconductor package and method of manufacturing the same

Semiconductor device including heat dissipation structure and fabricating method of the same

Semiconductor package and method of manufacturing the same

Semiconductor package including thermal relaxation block and manufacturing method thereof

Chamfered die of semiconductor package and method for forming the same

Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Method for fabricating device die

Device die and method for fabricating the same

Semiconductor package and method of manufacturing the same

Method for forming mark, packaging method of semiconductor device, and semiconductor device having the mark

Semiconductor device having a heat dissipation structure connected chip package

Semiconductor package with thermal relaxation block and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Chamfered die of semiconductor package and method for forming the same

Semiconductor package with thermal relaxation block and manufacturing method thereof

Circuit substrate, package structure and method of manufacturing the same

Semiconductor package and manufacturing method thereof

Semiconductor device including heat dissipation structure and fabricating method of the same

Manufacturing method of semiconductor package including thermal conductive block

Semiconductor package and manufacturing method thereof

TSMC SOLAR LTD

Indium sputtering method and materials for chalcopyrite-based material usable as solar cell absorber layers

Method of forming a buffer layer in a solar cell, and a solar cell formed by the method

Nozzle assembly and method for fabricating a solar cell

Method for removing non-bonding compound from polycrystalline materials on solar panel

Method of absorber surface repairing by solution process

Thin film solar cell and method of forming same

Method for indium sputtering and for forming chalcopyrite-based solar cell absorber layers

Evaporation apparatus and method

Sputtering apparatus and method

Absorber surface modification

INVENTEC PUDONG TECH CORP

Mount assembly for expansion card and circuit assembly

Power adapting box and fan module

Computer case

CM HK LTD

Systems and methods for facilitating exercise monitoring with real-time heart rate monitoring and motion analysis

Systems and methods for facilitating exercise monitoring with real-time heart rate monitoring and motion analysis

CIROCOMM TECH CORP

System for automatically inspecting and trimming a patch antenna

Method for automatically inspecting and trimming a patch antenna

CIROCOMM TECHNOLOGY CORP

Method for automatically inspecting and trimming a patch antenna

INNOCOM TECH SHENZHEN CO LTD

Liquid crystal display and display apparatus

ARK SEMICONDUCTOR CORP LTD

Synchronous rectifier controller and control method used for adjusting a voltage of a control terminal of a rectifier switch

QUANTA STORAGE INC

Writing method for solid state drive

ADVANCED SEMICONDUCTOR ENG

Semiconductor device package and method for manufacturing the same

UNIV CHANG GUNG

Method of producing and purifying soluble recombinant COQ5 protein and soluble recombinant COQ5 protein thereof

CHEN SHIH WEI

Molybdenum selenide sublayers with controlled thickness in solar cells and methods for forming the same