Inventor

HUANG YU-CHIH

TW82 patents

⚠️ This page may combine multiple inventors who share the name “HUANG YU-CHIH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HUANG YU-CHIH

TAIWAN SEMICONDUCTOR MFG CO LTD

Semiconductor package and manufacturing method thereof

Package structure and method of forming the same

Sensor package and method

Package structure

Fan out package structure and method of manufacturing the same

Contact area design for solder bonding

Contact area design for solder bonding

Warpage reduction and adhesion improvement of semiconductor die package

Semiconductor package and manufacturing method of semiconductor package

Package structure with through via extending through redistribution layer and method of manufacturing the same

Package structure and method of forming the same

Sensor package and method

Package structure with porous conductive structure and manufacturing method thereof

Semiconductor package and forming method thereof

Fan-out package structure and method of manufacturing the same

Fingerprint sensor pixel array and methods of forming same

Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device

Fingerprint sensor and manufacturing method thereof

Apparatus and method for monitoring reflectivity of the collector for extreme ultraviolet radiation source

Package structure and method of forming package structure

Fingerprint sensor in InFO structure and formation method

Fingerprint sensor device and method

Fingerprint sensor pixel array and methods of forming same

Fingerprint sensor pixel array and methods of forming same

Fingerprint sensor device and method

Semiconductor device

Semiconductor package and manufacturing method thereof

Substrate stage, substrate processing system using the same, and method for processing substrate

Package structure

Fingerprint sensor device and method

Fingerprint sensor in InFO structure and formation method

Package structure with through-via in molding compound and dielectric layer

Fingerprint sensor in info structure and formation method

Fingerprint sensor device and method

Fingerprint sensor device and method

Fingerprint sensor in InFO structure and formation method

Method of fabricating package structure

Package structure and method of forming the same

Package structure and method of forming the same

Sensor packages

Apparatus and method for generating extreme ultraviolet radiation

Package structure, package-on-package structure and method of fabricating the same

Semiconductor package and forming method thereof

Manufacturing method of fingerprint sensor

TAIWAN SEMICONDUCTOR MFG

Apparatus for detecting correct positioning of a wafer cassette

Warpage reduction and adhesion improvement of semiconductor die package

Apparatus and method for reducing particle contamination in an etcher

Composite shadow ring equipped with a sacrificial inner ring

Apparatus for the real-time monitoring and control of a wafer temperature

Thermocoupled lift pin system for etching chamber