Inventor

LIN PO-CHUN

TW69 patents

⚠️ This page may combine multiple inventors who share the name “LIN PO-CHUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIN PO-CHUN

NANYA TECHNOLOGY CORP

Chip package having tilted through silicon via

Chip package and a manufacturing method thereof

Semiconductor device and method for forming the same

Chip package and method for forming the same

Semiconductor package with lateral bump structure

Semiconductor chip and multi-chip package using thereof and method for manufacturing the same

Method for manufacturing a semiconductor structure

Package structure and manufacturing method thereof

Method for manufacturing a semiconductor structure

Semiconductor structure and manufacturing method thereof

Method for forming semiconductor package

Semiconductor structure with through substrate via and manufacturing method thereof

Semiconductor structure and method for forming the same

Semiconductor package and method for fabricating the same

Conductive connection structure having stress buffer layer

Wire bonding method and wire bonding structure

Semiconductor structure and manufacturing method thereof

Method of manufacturing through silicon via stacked structure

Semiconductor structure

Combing bump structure and manufacturing method thereof

Multi-chip semiconductor package, vertically-stacked devices and manufacturing thereof

Wire bonding method

Chip package

Chip package and method for forming the same

Integrated circuit device

Semiconductor apparatus and method for preparing the same

Method for preparing a semiconductor apparatus

Method for manufacturing package structure having elastic bump

Semiconductor package and method for preparing the same

Semiconductor structure and a manufacturing method thereof

Method for preparing a semiconductor package

Stacked package structure and manufacturing method thereof

Semiconductor chip and multi-chip package using thereof

Semiconductor structure

Electronic structure

Semiconductor package and method for forming the same

Semiconductor structure and manufacturing method thereof

Semiconductor device and method for manufacturing the same

Stacked package structure and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD

Package structure and method of forming the same

Package structure and method of forming the same

Semiconductor package and forming method thereof

Semiconductor package and manufacturing method thereof

Package structure and method of forming the same

Package structure and method of forming the same

Semiconductor package and forming method thereof

Circuit substrate, package structure and method of manufacturing the same

Semiconductor package and manufacturing method thereof

IBM

Chatbot orchestration

Interruption point determination