Inventor
BATZ JR ROBERT W
US19 patents
⚠️ This page may combine multiple inventors who share the name “BATZ JR ROBERT W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SEMITOOL INC
13 patentsUS6334937B1Jan 1, 2002
Apparatus for high deposition rate solder electroplating on a microelectronic workpiece
SEMITOOL INC104 citations95
US6911127B2Jun 28, 2005
Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
SEMITOOL INC17 citations92
US6806186B2Oct 19, 2004
Submicron metallization using electrochemical deposition
SEMITOOL INC21 citations92
US6527925B1Mar 4, 2003
Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
SEMITOOL INC23 citations92
US6527926B2Mar 4, 2003
Electroplating reactor including back-side electrical contact apparatus
SEMITOOL INC19 citations90
US6090711AJul 18, 2000
Methods for controlling semiconductor workpiece surface exposure to processing liquids
SEMITOOL INC29 citations88
US7144805B2Dec 5, 2006
Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current density
SEMITOOL INC8 citations73
US7048841B2May 23, 2006
Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
SEMITOOL INC5 citations73
US6939448B2Sep 6, 2005
Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
SEMITOOL INC6 citations73
US6849167B2Feb 1, 2005
Electroplating reactor including back-side electrical contact apparatus
SEMITOOL INC1 citations60
US6669834B2Dec 30, 2003
Method for high deposition rate solder electroplating on a microelectronic workpiece
SEMITOOL INC2 citations60
US6602383B1Aug 5, 2003
Apparatus and methods for controlling workpiece surface exposure to processing liquids during the fabrication of microelectronic components
SEMITOOL INC3 citations58
US7252714B2Aug 7, 2007
Apparatus and method for thermally controlled processing of microelectronic workpieces
SEMITOOL INC0 citations40
BASKARAN RAJESH
4 patentsUS8961771B2Feb 24, 2015
Electrolytic process using cation permeable barrier
BASKARAN RAJESH2 citations60
US8236159B2Aug 7, 2012
Electrolytic process using cation permeable barrier
BASKARAN RAJESH3 citations60
US8123926B2Feb 28, 2012
Electrolytic copper process using anion permeable barrier
BASKARAN RAJESH1 citations50
US8852417B2Oct 7, 2014
Electrolytic process using anion permeable barrier
BASKARAN RAJESH0 citations48