Inventor

NAGANO HIROSAKU

JP20 patents

⚠️ This page may combine multiple inventors who share the name “NAGANO HIROSAKU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NAGANO HIROSAKU

KANEGAFUCHI CHEMICAL IND

Thermally fusible adhesive copolymer, articles made therefrom, and method for producing the same

Polyimide having excellent thermal dimensional stability

Polyimide film

Polyimide having excellent thermal dimensional stability

Polyimide film and process for producing same

Thermoplastic polyimide polymer; thermoplastic polyimide film; polyimide laminate; and method of manufacturing the laminate

Polyimide film and manufacturing method thereof

Thermoplastic polyimide, polyamide acid, and thermally fusible laminated film for covering conductive wires

Method of improving adhesive property of polyimide film and polymidefilm having improved adhesive property

Process and apparatus for manufacturing polymers

Thermosetting resin composition and method of manufacturing it from an epoxy resin, cyanate and phenol

Process for producing flexible printed circuit board

Heat-resistant resin composition

Heat resistant polyamide-imide resin from polycarboxylic acid-polyisocyanate modified with unsaturated monomer

Process for continuous mixing of a two-liquid curing type resin

Laminate

Heat resistant resin composition comprising modified polyamide-imide resin having carboxyl groups

KANEKA CORP

Solid polymer electrolyte membrane, solid polymer electrolyte fuel cell using the membrane and method of fabricating the same

Copper foil with insulating adhesive

Multilayer structure and multilayer wiring board using the same