Inventor
GALVAGNI JOHN L
US38 patents
⚠️ This page may combine multiple inventors who share the name “GALVAGNI JOHN L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AVX CORP
36 patentsUS7463474B2Dec 9, 2008
System and method of plating ball grid array and isolation features for electronic components
AVX CORP171 citations99
US7152291B2Dec 26, 2006
Method for forming plated terminations
AVX CORP147 citations99
US7154374B2Dec 26, 2006
Plated terminations
AVX CORP136 citations99
US6960366B2Nov 1, 2005
Plated terminations
AVX CORP158 citations99
US5889445AMar 30, 1999
Multilayer ceramic RC device
AVX CORP150 citations99
US7344981B2Mar 18, 2008
Plated terminations
AVX CORP124 citations98
US7177137B2Feb 13, 2007
Plated terminations
AVX CORP173 citations98
US7161794B2Jan 9, 2007
Component formation via plating technology
AVX CORP126 citations98
US7067172B2Jun 27, 2006
Component formation via plating technology
AVX CORP126 citations98
US7054136B2May 30, 2006
Controlled ESR low inductance multilayer ceramic capacitor
AVX CORP77 citations98
US6982863B2Jan 3, 2006
Component formation via plating technology
AVX CORP127 citations98
US6972942B2Dec 6, 2005
Plated terminations
AVX CORP136 citations98
US6496355B1Dec 17, 2002
Interdigitated capacitor with ball grid array (BGA) terminations
AVX CORP104 citations98
US6243253B1Jun 5, 2001
Surface mount multilayer capacitor
AVX CORP199 citations97
US5880925AMar 9, 1999
Surface mount multilayer capacitor
AVX CORP351 citations97
US4085435AApr 18, 1978
Tantalum chip capacitor
AVX CORP152 citations97
US6757152B2Jun 29, 2004
Cascade capacitor
AVX CORP95 citations95
US7697262B2Apr 13, 2010
Multilayer ceramic capacitor with internal current cancellation and bottom terminals
AVX CORP29 citations93
US7414857B2Aug 19, 2008
Multilayer ceramic capacitor with internal current cancellation and bottom terminals
AVX CORP30 citations93
US7576968B2Aug 18, 2009
Plated terminations and method of forming using electrolytic plating
AVX CORP31 citations90
US7006359B2Feb 28, 2006
Modular electronic assembly and method of making
AVX CORP36 citations90
US6535105B2Mar 18, 2003
Electronic device and process of making electronic device
AVX CORP34 citations88
US7016175B2Mar 21, 2006
Window via capacitor
AVX CORP14 citations84
US6963493B2Nov 8, 2005
Multilayer electronic devices with via components
AVX CORP17 citations84
US7724496B2May 25, 2010
Multilayer vertically integrated array technology
AVX CORP9 citations82
US7263764B2Sep 4, 2007
Method for adjusting performance characteristics of a multilayer component
AVX CORP12 citations82
US4059887ANov 29, 1977
Tantalum chip capacitor and method of manufacture
AVX CORP23 citations82
US4297773ANov 3, 1981
Method of manufacturing a monolithic ceramic capacitor
AVX CORP18 citations74
US10366835B2Jul 30, 2019
Plated terminations
AVX CORP1 citations73
US7170737B2Jan 30, 2007
Window via capacitor
AVX CORP9 citations73
US4791006ADec 13, 1988
High accuracy variable thickness laydown method for electronic components
AVX CORP18 citations67
US11195659B2Dec 7, 2021
Plated terminations
AVX CORP0 citations62
US7573698B2Aug 11, 2009
Window via capacitors
AVX CORP6 citations62
US7889020B2Feb 15, 2011
Asymmetrical filter
AVX CORP5 citations61
US10020116B2Jul 10, 2018
Plated terminations
AVX CORP0 citations52
US7832618B2Nov 16, 2010
Termination bonding
AVX CORP0 citations52