Inventor
KUNO TAKAKI
JP8 patents
⚠️ This page may combine multiple inventors who share the name “KUNO TAKAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOWA CORP
7 patentsUS5753538AMay 19, 1998
Method of sealing electronic parts with molded resin and mold employed therefor
TOWA CORP42 citations89
US6436331B1Aug 20, 2002
Method of resin sealing a gap between a semiconductor chip and a substrate
TOWA CORP13 citations71
US7901797B2Mar 8, 2011
Low-adhesion material, resin molding die, and soil resistant material
TOWA CORP2 citations61
US7732037B2Jun 8, 2010
Conductive porous material, resin molding die employing the same, and method of preparing conductive porous material
TOWA CORP2 citations61
US7614293B2Nov 10, 2009
Method of evaluating adhesion property, low-adhesion material, and mold for molding resin
TOWA CORP2 citations60
US7784764B2Aug 31, 2010
Low-adhesion material, mold for molding resin using the same and contaminant adhesion preventing material
TOWA CORP2 citations59
US7407146B2Aug 5, 2008
Composite material and resin mold
TOWA CORP3 citations58