Inventor
MAEDA KEIJI
JP18 patents
⚠️ This page may combine multiple inventors who share the name “MAEDA KEIJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOWA CORP
9 patentsUS6346433B1Feb 12, 2002
Method of coating semiconductor wafer with resin and mold used therefor
TOWA CORP27 citations91
US6773247B1Aug 10, 2004
Die used for resin-sealing and molding an electronic component
TOWA CORP31 citations90
US5783220AJul 21, 1998
Resin sealing and molding apparatus for sealing electronic parts
TOWA CORP19 citations84
US5750154AMay 12, 1998
Resin sealing/molding apparatus for electronic parts
TOWA CORP7 citations72
US7901797B2Mar 8, 2011
Low-adhesion material, resin molding die, and soil resistant material
TOWA CORP2 citations61
US7732037B2Jun 8, 2010
Conductive porous material, resin molding die employing the same, and method of preparing conductive porous material
TOWA CORP2 citations61
US7614293B2Nov 10, 2009
Method of evaluating adhesion property, low-adhesion material, and mold for molding resin
TOWA CORP2 citations60
US7784764B2Aug 31, 2010
Low-adhesion material, mold for molding resin using the same and contaminant adhesion preventing material
TOWA CORP2 citations59
US7407146B2Aug 5, 2008
Composite material and resin mold
TOWA CORP3 citations58
JUNIPER NETWORKS INC
4 patentsUS7760662B2Jul 20, 2010
Data transfer system and method
JUNIPER NETWORKS INC17 citations92
US7486690B2Feb 3, 2009
Data transfer system and method of transferring data packets using aggregation/disaggregation
JUNIPER NETWORKS INC12 citations92
US6904049B1Jun 7, 2005
Data transfer system and method for transferring data packets over an ATM link
JUNIPER NETWORKS INC31 citations92
US7957416B2Jun 7, 2011
Data transfer system and method
JUNIPER NETWORKS INC0 citations51