Inventor
WILSON ROBIN
GB40 patents
⚠️ This page may combine multiple inventors who share the name “WILSON ROBIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ICEMOS TECHNOLOGY LTD
17 patentsUS7576404B2Aug 18, 2009
Backlit photodiode and method of manufacturing a backlit photodiode
ICEMOS TECHNOLOGY LTD28 citations92
US7972934B2Jul 5, 2011
Photodetector array using isolation diffusions as crosstalk inhibitors between adjacent photodiodes
ICEMOS TECHNOLOGY LTD10 citations84
US7601556B2Oct 13, 2009
Front side electrical contact for photodetector array and method of making same
ICEMOS TECHNOLOGY LTD10 citations84
US7560791B2Jul 14, 2009
Front lit PIN/NIP diode having a continuous anode/cathode
ICEMOS TECHNOLOGY LTD13 citations84
US7553764B2Jun 30, 2009
Silicon wafer having through-wafer vias
ICEMOS TECHNOLOGY LTD14 citations84
US7579667B2Aug 25, 2009
Bonded-wafer superjunction semiconductor device
ICEMOS TECHNOLOGY LTD7 citations73
US7528458B2May 5, 2009
Photodiode having increased proportion of light-sensitive area to light-insensitive area
ICEMOS TECHNOLOGY LTD7 citations73
US8030133B2Oct 4, 2011
Method of fabricating a bonded wafer substrate for use in MEMS structures
ICEMOS TECHNOLOGY LTD2 citations63
US7768085B2Aug 3, 2010
Photodetector array using isolation diffusions as crosstalk inhibitors between adjacent photodiodes
ICEMOS TECHNOLOGY LTD4 citations62
US7741172B2Jun 22, 2010
Positive-intrinsic-negative (PIN)/negative-intrinsic-positive (NIP) diode
ICEMOS TECHNOLOGY LTD2 citations62
US7741141B2Jun 22, 2010
Photodiode having increased proportion of light-sensitive area to light-insensitive area
ICEMOS TECHNOLOGY LTD5 citations62
US7579273B2Aug 25, 2009
Method of manufacturing a photodiode array with through-wafer vias
ICEMOS TECHNOLOGY LTD3 citations62
US7999348B2Aug 16, 2011
Technique for stable processing of thin/fragile substrates
ICEMOS TECHNOLOGY LTD0 citations52
US7910479B2Mar 22, 2011
Method of manufacturing a photodiode array with through-wafer vias
ICEMOS TECHNOLOGY LTD0 citations52
US7821089B2Oct 26, 2010
Photodetector array using isolation diffusions as crosstalk inhibitors between adjacent photodiodes
ICEMOS TECHNOLOGY LTD0 citations52
US7489014B2Feb 10, 2009
Front side electrical contact for photodetector array and method of making same
ICEMOS TECHNOLOGY LTD1 citations52
US7709950B2May 4, 2010
Silicon wafer having through-wafer vias
ICEMOS TECHNOLOGY LTD0 citations47
WILSON ROBIN
10 patentsUS8249500B2Aug 21, 2012
Tuneable NFC device
WILSON ROBIN44 citations97
US8588682B2Nov 19, 2013
Near field RF communicators having refined energy sharing characterisitics utilizing improved shunt current control
WILSON ROBIN22 citations92
USD609285SFeb 2, 2010
Stuffed toy with fact memory chip
WILSON ROBIN26 citations91
US8503931B2Aug 6, 2013
Tuneable NFC-enabled device
WILSON ROBIN11 citations84
US8188787B2May 29, 2012
Peak detector for detecting peaks in a modulated signal
WILSON ROBIN13 citations83
US8058091B2Nov 15, 2011
Front lit PIN/NIP diode having a continuous anode/cathode
WILSON ROBIN2 citations62
US8253243B2Aug 28, 2012
Bonded wafer substrate utilizing roughened surfaces for use in MEMS structures
WILSON ROBIN0 citations52
US8169057B2May 1, 2012
Positive-intrinsic-negative (PIN)/negative-intrinsic-positive (NIP) diode
WILSON ROBIN0 citations51
US8148203B2Apr 3, 2012
Technique for stable processing of thin/fragile substrates
WILSON ROBIN0 citations51
US8294508B2Oct 23, 2012
Method and device for driving the frequency of a clock signal of an integrated circuit
WILSON ROBIN1 citations45
ICEMOS TECHNOLOGY CORP
3 patentsUS7446018B2Nov 4, 2008
Bonded-wafer superjunction semiconductor device
ICEMOS TECHNOLOGY CORP33 citations91
US7429772B2Sep 30, 2008
Technique for stable processing of thin/fragile substrates
ICEMOS TECHNOLOGY CORP6 citations72
US7439178B2Oct 21, 2008
Technique for stable processing of thin/fragile substrates
ICEMOS TECHNOLOGY CORP1 citations61