Inventor

PAN SHENG-LIANG

TW63 patents

⚠️ This page may combine multiple inventors who share the name “PAN SHENG-LIANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PAN SHENG-LIANG

TAIWAN SEMICONDUCTOR MFG

High transmittance overcoat for optimization of long focal length microlens arrays in semiconductor color imagers

High efficiency color filter process for semiconductor array imaging devices

Method of making a bump on a substrate using multiple photoresist layers

High efficiency color filter process to improve color balance in semiconductor array imaging devices

High efficiency color filter process for semiconductor array imaging devices

Multi-microlens design for semiconductor imaging devices to increase light collection efficiency in the color filter process

Bump reflow method by inert gas plasma

Plasma etch method for forming uniform linewidth residue free patterned composite silicon containing dielectric layer/silicon stack layer

Method for forming micro lens structures

Insitu contact descum for self-aligned contact process

High transmittance overcoat for microlens arrays in semiconductor color imagers

Method for fabricating microelectronic product with attenuated bond pad corrosion

Spin-on-glass nonetchback planarization process using oxygen plasma treatment

Method for making long focal length micro-lens for color filters

Wafer rinse tank for metal etching and method for using

Anti-corrosion etch process for etching metal interconnections extending over and within contact openings

Method and system for patterning alignment marks on a transparent substrate

Method of reducing the roughness of a gate insulator layer after exposure of the gate insulator layer to a threshold voltage implantation procedure

Photoresist stripper using nitrogen bubbler

Method to improve passivation openings by reflow of photoresist to eliminate tape residue

Method to form the ring shape contact to cathode on wafer edge for electroplating in the bump process when using the negative type dry film photoresist

Method to enhance the adhesion between dry film and seed metal

Passivation photoresist stripping method to eliminate photoresist extrusion after alloy

Selective electroplating method employing annular edge ring cathode electrode contact

Method for cleaning metal precipitates in semiconductor processes

Material to improve image sensor yield during wafer sawing

Material to improve CMOS image sensor yield during wafer sawing

Method for improved photomask alignment after epitaxial process through 90° orientation change

TAIWAN SEMICONDUCTOR MFG CO LTD

Tuning threshold voltage through meta stable plasma treatment

Tuning threshold voltage through meta stable plasma treatment

Fin field-effect transistor device and method

Shared contact structure and methods for forming the same

Tuning threshold voltage through meta stable plasma treatment

Fin field-effect transistor device and method

DC bias in plasma process

Dry ashing by secondary excitation

Shared contact structure and methods for forming the same

Layer for side wall passivation

Fin Field-Effect Transistor device and method

Semiconductor device and method

Tuning threshold voltage through meta stable plasma treatment

Semiconductor device and method

Fin field-effect transistor device and method

Semiconductor device and method

Soft ashing process for forming protective layer on conductive cap layer of semiconductor device

Interconnect structure for semiconductor devices

DC bias in plasma process

Interconnect structure for semiconductor devices

Soft ashing process for forming protective layer on conductive cap layer of semiconductor device

TAIWAN SEMICONDUCTOR MFG LTD

Efficient method for monitoring gate oxide damage related to plasma etch chamber processing history