Inventor

BYUN HYUNG JIK

KR2 patents

Patents

2 patents

US6736306B2May 18, 2004

Semiconductor chip package comprising enhanced pads

SAMSUNG ELECTRONICS CO LTD27 citations88

US7023096B2Apr 4, 2006

Multi-chip package having spacer that is inserted between chips and manufacturing method thereof

SAMSUNG ELECTRONICS CO LTD7 citations69