Inventor
NAKAGAWA YUKITO
JP18 patents
⚠️ This page may combine multiple inventors who share the name “NAKAGAWA YUKITO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CANON ANELVA CORP
7 patentsUS9685299B2Jun 20, 2017
Substrate processing apparatus, etching method of metal film, and manufacturing method of magnetoresistive effect element
CANON ANELVA CORP14 citations83
US9734989B2Aug 15, 2017
Method for manufacturing semiconductor device, ion beam etching device, and control device
CANON ANELVA CORP3 citations70
US9190287B2Nov 17, 2015
Method of fabricating fin FET and method of fabricating device
CANON ANELVA CORP3 citations61
US9721747B2Aug 1, 2017
Grid, method of manufacturing the same, and ion beam processing apparatus
CANON ANELVA CORP0 citations50
US9640754B2May 2, 2017
Process for producing magnetoresistive effect element
CANON ANELVA CORP0 citations50
US10026591B2Jul 17, 2018
Method for manufacturing semiconductor device, ion beam etching device, and control device
CANON ANELVA CORP1 citations49
US8007633B2Aug 30, 2011
Surface processing apparatus
CANON ANELVA CORP0 citations40
ANELVA CORP
5 patentsUS6462482B1Oct 8, 2002
Plasma processing system for sputter deposition applications
ANELVA CORP87 citations97
US6339997B1Jan 22, 2002
Plasma processing apparatus
ANELVA CORP21 citations92
US4919783AApr 24, 1990
Apparatus for processing an object by gas plasma with a reduced damage
ANELVA CORP30 citations90
US6664496B2Dec 16, 2003
Plasma processing system
ANELVA CORP13 citations83
US5961776AOct 5, 1999
Surface processing apparatus
ANELVA CORP15 citations72
NEC CORP
4 patentsUS6043608AMar 28, 2000
Plasma processing apparatus
NEC CORP73 citations94
US5936352AAug 10, 1999
Plasma processing apparatus for producing plasma at low electron temperatures
NEC CORP20 citations92
US5900699AMay 4, 1999
Plasma generator with a shield interposing the antenna
NEC CORP49 citations92
US5565738AOct 15, 1996
Plasma processing apparatus which uses a uniquely shaped antenna to reduce the overall size of the apparatus with respect to the plasma chamber
NEC CORP53 citations90