Inventor
YEH JUN-LIN
TW21 patents
⚠️ This page may combine multiple inventors who share the name “YEH JUN-LIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
WINBOND ELECTRONICS CORP
13 patentsUS5862073AJan 19, 1999
Floating gate memory array device with improved program and read performance
WINBOND ELECTRONICS CORP17 citations82
US7203107B2Apr 10, 2007
Device and method for compensating defect in semiconductor memory
WINBOND ELECTRONICS CORP6 citations73
US10249376B2Apr 2, 2019
Flash memory storage device and operating method thereof
WINBOND ELECTRONICS CORP2 citations72
US6147529ANov 14, 2000
Voltage sensing circuit
WINBOND ELECTRONICS CORP3 citations63
US7020003B2Mar 28, 2006
Device and method for compensating defect in semiconductor memory
WINBOND ELECTRONICS CORP4 citations62
US9214495B1Dec 15, 2015
Memory cell structure and formation method thereof
WINBOND ELECTRONICS CORP2 citations61
US8885383B1Nov 11, 2014
Flash memory and layout method thereof
WINBOND ELECTRONICS CORP2 citations60
US9136008B1Sep 15, 2015
Flash memory apparatus and data reading method thereof
WINBOND ELECTRONICS CORP1 citations52
US9104401B2Aug 11, 2015
Flash memory apparatus with serial interface and reset method thereof
WINBOND ELECTRONICS CORP0 citations52
US11682470B2Jun 20, 2023
Memory device and operating method thereof
WINBOND ELECTRONICS CORP0 citations51
US10762970B2Sep 1, 2020
Inspection method for memory integrity, nonvolatile memory and electronic device
WINBOND ELECTRONICS CORP0 citations41
US10566060B2Feb 18, 2020
Memory device and program/erase method therefor
WINBOND ELECTRONICS CORP0 citations41
US9281020B2Mar 8, 2016
Storage medium and accessing system utilizing the same
WINBOND ELECTRONICS CORP0 citations41
TAIWAN SEMICONDUCTOR MFG CO LTD
4 patentsUS9425126B2Aug 23, 2016
Dummy structure for chip-on-wafer-on-substrate
TAIWAN SEMICONDUCTOR MFG CO LTD883 citations99
US10113233B2Oct 30, 2018
Multi-zone temperature control for semiconductor wafer
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations83
US9754831B2Sep 5, 2017
Dummy structure for chip-on-wafer-on-substrate
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9023664B2May 5, 2015
Multi-zone temperature control for semiconductor wafer
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations62