Inventor

KUO CHEN-CHENG

TW97 patents

⚠️ This page may combine multiple inventors who share the name “KUO CHEN-CHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KUO CHEN-CHENG

TAIWAN SEMICONDUCTOR MFG

Tapered through-silicon via structure

Through-substrate via for semiconductor device

Structure and process for the formation of TSVs

Tapered through-silicon via structure

Dual damascene approach for small geometry dimension

Metal routing architecture for integrated circuits

Through-silicon via with scalloped sidewalls

Structure and process for the formation of TSVs

Multi-die wafer level packaging

Method for proximity effect compensation on alternative phase-shift masks with bias and optical proximity correction

Bonded structures for package and substrate

Through silicon via with dummy structure and method for forming the same

Liquid dispensing system and method for dispensing

Semiconductor device having conductive pads and a method of manufacturing the same

Connector structures of integrated circuits

Method for depositing a polyimide film

Semiconductor structure with a discontinuous material density for reducing eddy currents

Pad alignment for AlCu pad for copper process

Bonded structures for package and substrate

TAIWAN SEMICONDUCTOR MFG CO LTD

Semiconductor packages and manufacturing methods thereof

Package structures and methods for forming the same

Metal routing architecture for integrated circuits

Scheme for connector site spacing and resulting structures

Semiconductor device and method

Improving the strength of micro-bump joints

Bonded structures for package and substrate

Semiconductor package and method of fabricating semiconductor package

Stress reduction apparatus and method

Bump on pad (BOP) bonding structure in semiconductor packaged device

Bonded structures for package and substrate

Semiconductor package and method of fabricating semiconductor package

Connector structures of integrated circuits

Chip packages and methods of manufacture thereof

Bonded structures for package and substrate

CHEN CHIH-HUA

Through-silicon vias and methods for forming the same

Zigzag pattern for TSV copper adhesion

Method of forming through silicon via with dummy structure

Conductive pillar structure for semiconductor substrate and method of manufacture

KUO CHEN-CHENG

Structures for preventing cross-talk between through-silicon vias and integrated circuits

Semiconductor device having conductive pads and a method of manufacturing the same

Process for making conductive post with footing profile

CHUANG YAO-CHUN

T-shaped post for semiconductor devices

Lead free solder interconnections for integrated circuits

Stress reduction apparatus

LIU JEN-CHENG

Bonding process for CMOS image sensor

Shen wen-wei

Strength of micro-bump joints

HSIAO CHING-WEN

Package structures and methods for forming the same

LIU TZUAN-HORNG

Dummy metal design for packaging structures

SHEN CHENG HUNG

Substrate stand-offs for semiconductor devices

DENTEQUE

Apparatus for dispensing dental solutions