Inventor

HONG JONG WAN

KR5 patents

⚠️ This page may combine multiple inventors who share the name “HONG JONG WAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YOO HYUN JEE

2 patents

US9695345B2Jul 4, 2017

Dicing die bonding film having excellent burr property and reliability and semiconductor device using the same

YOO HYUN JEE4 citations67

US9659763B2May 23, 2017

Epoxy-based composition, adhesive film, dicing die-bonding film and semiconductor device

YOO HYUN JEE0 citations47

HONG JONG WAN

2 patents

US8541289B2Sep 24, 2013

Dicing die bonding film and dicing method

HONG JONG WAN1 citations46

US8207616B2Jun 26, 2012

Adhesive film, dicing die bonding film and semiconductor device using the same

HONG JONG WAN1 citations46

LG CHEMICAL LTD

1 patent

US9793103B2Oct 17, 2017

Epoxy-based composition, adhesive film, dicing die-bonding film and semiconductor device

LG CHEMICAL LTD0 citations50