P

Inventor

COOK BETH R

US27 patents
⚠️ This page may combine multiple inventors who share the name “COOK BETH R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MICRON TECHNOLOGY INC

25 patents
US10396145B2Aug 27, 2019

Memory cells comprising ferroelectric material and including current leakage paths having different total resistances

MICRON TECHNOLOGY INC19 citations94
US9231206B2Jan 5, 2016

Methods of forming a ferroelectric memory cell

MICRON TECHNOLOGY INC21 citations92
US10879344B2Dec 29, 2020

Memory cells comprising ferroelectric material and including current leakage paths having different total resistances

MICRON TECHNOLOGY INC4 citations84
US10650978B2May 12, 2020

Methods of incorporating leaker devices into capacitor configurations to reduce cell disturb

MICRON TECHNOLOGY INC7 citations84
US10403630B2Sep 3, 2019

Semiconductor devices including ferroelectric materials

MICRON TECHNOLOGY INC3 citations84
US9698343B2Jul 4, 2017

Semiconductor device structures including ferroelectric memory cells

MICRON TECHNOLOGY INC3 citations84
US11170834B2Nov 9, 2021

Memory cells and methods of forming a capacitor including current leakage paths having different total resistances

MICRON TECHNOLOGY INC9 citations83
US10833092B2Nov 10, 2020

Methods of incorporating leaker-devices into capacitor configurations to reduce cell disturb, and capacitor configurations incorporating leaker-devices

MICRON TECHNOLOGY INC1 citations73
US10090462B2Oct 2, 2018

Resistive memory devices

MICRON TECHNOLOGY INC2 citations73
US12336185B2Jun 17, 2025

Memory device assembly with non-impinged leaker devices

MICRON TECHNOLOGY INC1 citations64
US10062703B2Aug 28, 2018

Methods of forming a ferroelectric memory cell

MICRON TECHNOLOGY INC1 citations63
US9431606B1Aug 30, 2016

Memory cells

MICRON TECHNOLOGY INC2 citations63
US12167610B2Dec 10, 2024

Semiconductor devices including ferroelectric materials

MICRON TECHNOLOGY INC0 citations62
US11711924B2Jul 25, 2023

Methods of forming structures containing leaker-devices and memory configurations incorporating leaker-devices

MICRON TECHNOLOGY INC0 citations62
US11676768B2Jun 13, 2023

Methods of incorporating leaker devices into capacitor configurations to reduce cell disturb, and capacitor configurations incorporating leaker devices

MICRON TECHNOLOGY INC0 citations62
US11600691B2Mar 7, 2023

Memory cells comprising ferroelectric material and including current leakage paths having different total resistances

MICRON TECHNOLOGY INC0 citations62
US11404217B2Aug 2, 2022

Methods of incorporating leaker devices into capacitor configurations to reduce cell disturb, and capacitor configurations incorporating leaker devices

MICRON TECHNOLOGY INC0 citations62
US11315939B2Apr 26, 2022

Methods of incorporating leaker-devices into capacitor configurations to reduce cell disturb, and capacitor configurations incorporating leaker-devices

MICRON TECHNOLOGY INC0 citations62
US11043502B2Jun 22, 2021

Semiconductor devices including ferroelectric materials

MICRON TECHNOLOGY INC0 citations62
US10903218B2Jan 26, 2021

Methods of incorporating leaker-devices into capacitor configurations to reduce cell disturb, and capacitor configurations incorporating leaker-devices

MICRON TECHNOLOGY INC0 citations62
US8633084B1Jan 21, 2014

Methods of forming a memory cell having programmable material that comprises a multivalent metal oxide portion and an oxygen containing dielectric portion

MICRON TECHNOLOGY INC2 citations62
US11935574B2Mar 19, 2024

Memory cells and methods of forming a capacitor including current leakage paths having different total resistances

MICRON TECHNOLOGY INC0 citations60
US10680057B2Jun 9, 2020

Methods of forming a capacitor comprising ferroelectric material and including current leakage paths having different total resistances

MICRON TECHNOLOGY INC0 citations52
US9324943B2Apr 26, 2016

Filamentary memory devices and methods

MICRON TECHNOLOGY INC0 citations51
US8809157B2Aug 19, 2014

Methods of forming a programmable region that comprises a multivalent metal oxide portion and an oxygen containing dielectric portion

MICRON TECHNOLOGY INC0 citations51

RAMASWAMY DURAI VISHAK NIRMAL

1 patent

BI LEI

1 patent