Inventor

WU CHENG-MING

TW58 patents

⚠️ This page may combine multiple inventors who share the name “WU CHENG-MING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WU CHENG-MING

TAIWAN SEMICONDUCTOR MFG

Method for fabricating small-size two-step contacts for word-line strapping on dynamic random access memory (DRAM)

Robust dual damascene process

Reduction of the aspect ratio of deep contact holes for embedded DRAM devices

Method for reducing bonding pad loss using a capping layer when etching bonding pad passivation openings

Process for making embedded DRAM circuits having capacitor under bit-line (CUB)

Microelectronic fabrication method employing self-aligned selectively deposited silicon layer

Process to fabricate a cylindrical, capacitor structure under a bit line structure for a dynamic random access memory cell

Method to form a recess free deep contact

Keyhole-free process for high aspect ratio gap filing

Method for improving the yield on dynamic random access memory (DRAM) with cylindrical capacitor structures

Etch recipe for embedded DRAM passivation with etch stopping layer scheme

Method for making a fuse structure for improved repaired yields on semiconductor memory devices

Process for making new and improved crown-shaped capacitors on dynamic random access memory cells

Method for fabricating a self-aligned contact

Method for making a fuse structure for improved repaired yields on semiconductor memory devices

Method for making cylinder-shaped capacitors for dynamic random access memory

Inter-level dielectric planarization approach for a DRAM crown capacitor process

Node process integration technology to improve data retention for logic based embedded dram

Trench-free buried contact

Method for making a more reliable storage capacitor for dynamic random access memory (DRAM)

Method for photoresist development with improved CD

Method for making reticles with reduced particle contamination and reticles formed

Process for forming a crown shaped capacitor structure for a DRAM device

Process to form a trench-free buried contact

Photoresist removal from alignment marks through wafer edge exposure

TAIWAN SEMICONDUCTOR MFG CO LTD

Methods of fabricating semiconductor devices having conductive pad structures with multi-barrier films

Structures and methods for phase detection auto focus

Vertically arranged semiconductor pixel sensor

Method for manufacturing image sensor including forming FinFET transfer gate having a plurality of channel fins above a p-type region

Semiconductor arrangement with isolation structure

Pixel array including time-of-flight sensors

Optical fingerprint sensor with enhanced anti-counterfeiting features

Stacked image sensors and methods of formation

Pixel array including octagon pixel sensors

Pixel array including time-of-flight sensors

Vertically arranged semiconductor pixel sensor

Pixel array including octagon pixel sensors

Pixel array including octagon pixel sensors

Semiconductor arrangement with isolation structure

Pixel array including octagon pixel sensors

Semiconductor devices having conductive pad structures with multi-barrier films

Methods of fabricating semiconductor devices having conductive pad structures with multi-barrier films

Method of forming high voltage transistor and structure resulting therefrom

Semiconductor structure and method of manufacturing the same

Integration of solar cell and image sensor

GOPRO INC

Camera

Camera

WU CHENG-MING

Control device for cordless blind with willful stop

Control device for arising, falling and positioning a blind

BAO SONG PREC INDUSTRY CO LTD

Electric curtain control mechanism