Inventor

XIE JIANYONG

CN37 patents

⚠️ This page may combine multiple inventors who share the name “XIE JIANYONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

XIE JIANYONG

INTEL CORP

Power-delivery methods for embedded multi-die interconnect bridges and methods of assembling same

Power delivery for embedded bridge die utilizing trench structures

Power delivery for embedded bridge die utilizing trench structures

Semiconductor package with through bridge die connections

Power delivery for embedded bridge die utilizing trench structures

Power delivery for embedded bridge die utilizing trench structures

Power delivery for embedded bridge die utilizing trench structures

Capacitor die embedded in package substrate for providing capacitance to surface mounted die

Power-delivery methods for embedded multi-die interconnect bridges and methods of assembling same

Horizontal pitch translation using embedded bridge dies

Power delivery for embedded bridge die utilizing trench structures

Semiconductor packages with chiplets coupled to a memory device

Capacitor die embedded in package substrate for providing capacitance to surface mounted die

Dielectric-filled trench isolation of vias

Interconnect hub for dies

Semiconductor packages with chiplets coupled to a memory device

Minimization of insertion loss variation in through-silicon vias (TSVs)

Multilevel die complex with integrated discrete passive components

Dielectric-filled trench isolation of vias

Low-inductance current paths for on-package power distributions and methods of assembling same

Capacitor die embedded in package substrate for providing capacitance to surface mounted die

Signal routing carrier

Low-inductance current paths for on-package power distributions and methods of assembling same

Package design scheme for enabling high-speed low-loss signaling and mitigation of manufacturing risk and cost

Horizontal pitch translation using embedded bridge dies

Embedded very high density (VHD) layer

Architecture and processes to enable high capacity memory packages through memory die stacking

EMIB architecture with dedicated metal layers for improving power delivery

Substrateless double-sided embedded multi-die interconnect bridge

PETROCHINA CO LTD

Core-shell structured non-ionic nanoemulsion system and preparation and use thereof

Core-shell structured anionic nano microemulsion system, and preparation and application thereof

N,N,N′,N′-tetradodecyl-substituted diphenyl ether sulfonate anionic Gemini surfactant and synthesis method thereof

Nonionic Gemini surfactant of (octylphenol polyoxyethylene ether disubstituted) dicarboxylic acid diphenyl ether and its synthesis method

UNIV SOUTHWEST PETROLEUM

Method for enhancing the recovery factor of heavy oil by in-situ oil-water emulsion with high phase inversion point

XIE JIANYONG

Electrical-thermal co-simulation with joule heating and convection effects for 3D systems

UNIV LANZHOU

Device for determining threshold wind speed in intermittent wind-sand flow

LI QINGENG

Benzodiazepine derivative and use thereof